JAJSL91 april   2021 LM117QML-SP

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configurations and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: 0.5–A IOUT Devices (LM117H, LM117GW)
    6. 7.6  Parameter Drift: 0.5–A IOUT Devices (LM117H, LM117GW)
    7. 7.7  Electrical Characteristics: 1.5–A IOUT Devices (LM117K)
    8. 7.8  Parameter Drift: 1.5–A IOUT Devices (LM117K)
    9. 7.9  Quality Conformance Inspection
    10. 7.10 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Setting Output Voltage
    4. 8.4 External Capacitors
    5. 8.5 Load Regulation
    6. 8.6 Protection Diodes
  10. 9 Application and Implementation
    1. 9.1 Typical Applications
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 サード・パーティ製品に関する免責事項
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Power dissipation(2)Internally limited
Input-output voltage differential–0.340V
TstgStorage temperature–65150°C
TJmaxMaximum junction temperature150°C
Lead temperature metal package300°C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax – TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2 W for the TO-39 and CFP packages, and 20 W for the TO-3 package.