SNVS533D September   2007  – November 2014 LM4510

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Short Circuit Protection
      2. 7.3.2 Feedback Fault Protection
      3. 7.3.3 Input Undervoltage Lock-Out
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Non-Synchronous Operation
      2. 7.4.2 Operation in Synchronous Continuous Conduction Mode (Cycle 1, Cycle 2)
        1. 7.4.2.1 Cycle 1 Description
        2. 7.4.2.2 Cycle 2 Description
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 2.7 V to 5.5 V Input with a 16 V Output
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Adjusting Output Voltage
          2. 8.2.1.2.2 Maximum Output Current
          3. 8.2.1.2.3 Inductor Selection
          4. 8.2.1.2.4 IL_AVE Check
          5. 8.2.1.2.5 Input Capacitor Selection
          6. 8.2.1.2.6 Output Capacitor Selection
          7. 8.2.1.2.7 Soft-Start Function and Soft-Start Capacitor Selection
          8. 8.2.1.2.8 Compensation Component Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Flash and Torch Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings(1)(2)(11)

MIN MAX UNIT
VIN −0.3 6.5 V
VOUT −0.3 21 V
SW(3) –0.3 VOUT+0.3 V
EN, SS, COMP FB −0.3 6.5 V
PGND to AGND −0.2 0.2 V
Continuous power dissipation(4) Internally Limited
Junction temperature (TJ-MAX) 150 150 °C
Lead temperature (soldering, 10 sec)(5) 260 °C

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000 V
Machine model 200 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
Supply voltage (VIN) 2.7 5.5 V
Junction temperature (TJ)(6) −40 125 °C
Output voltage (VOUT) 18 V

6.4 Thermal Information

THERMAL METRIC(1) LM4510 UNIT
DSC
10 PINS
RθJA Junction-to-ambient thermal resistance 36 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.3
RθJB Junction-to-board thermal resistance 22
ψJT Junction-to-top characterization parameter 0.6
ψJB Junction-to-board characterization parameter 22.1
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise stated the following conditions apply: VIN = 3.6 V, EN = 3.6 V, TJ = 25°C.
PARAMETER TEST CONDITIONS MIN(7) TYP(8) MAX(7) UNIT
VFB FB Pin Voltage 2.7 V ≤ VIN ≤ 5.5 V 1.265 V
2.7 V ≤ VIN ≤ 5.5 V, −40°C ≤ TJ ≤ 125°C 1.24 1.29
IFB FB Pin Bias Current(10) −40°C ≤ TJ ≤ 125°C 0.050 1.5 µA
RDS(on) NMOS Switch RDS(on) ISW = 0.3 A 0.45 1.1 Ω
PMOS Switch RDS(on) ISW = 0.3 A, VOUT = 10 V 0.9 1.1
ICL NMOS Switch Current Limit 1 1.2 1.8 A
IQ Device Switching EN = 3.6 V, FB = COMP 1.7 mA
EN = 3.6 V, FB = COMP, −40°C ≤ TJ ≤ 125°C 2.5
Non-switching Current EN = 3.6 V, FB > 1.29 V 0.8
EN = 3.6 V, FB > 1.29 V, −40°C ≤ TJ ≤ 125°C 2
Shutdown Current EN = 0 V 0.002 0.050 µA
IL SW Leakage Current(10) SW = 20 V 0.01 0.150 µA
IVOUT VOUT Bias Current(10) VOUT = 20 V 90 µA
VOUT = 20 V, −40°C ≤ TJ ≤ 125°C 50 150
IVL PMOS Switch Leakage Current SW = 0 V, VOUT = 20 V 0.001 0.100 µA
fSW Switching Frequency 1 MHz
−40°C ≤ TJ ≤ 125°C 0.85 1.2
DMAX Maximum Duty Cycle FB = 0 V 94%
FB = 0 V, −40°C ≤ TJ ≤ 125°C 88%
DMIN Minimum Duty Cycle 15% 20%
Gm Error Amplifier Transconductance 130 µmho
−40°C ≤ TJ ≤ 125°C 70 200
EN
Threshold		 Device Enable HIGH 0.81 V
HIGH, −40°C ≤ TJ ≤ 125°C 1.2
Device Shutdown LOW 0.78
LOW, −40°C ≤ TJ ≤ 125°C 0.4
IEN EN Pin Bias Current 0 < EN < 3.6 V 3.2 µA
0 < EN < 3.6 V, −40°C ≤ TJ ≤ 125°C 8
FB Fault Protection Feedback Fault Protection ON Threshold 19.7 V
ON Threshold, −40°C ≤ TJ ≤ 125°C 18 20.7
OFF Threshold 18.7
OFF Threshold, −40°C ≤ TJ ≤ 125°C 17 20
UVLO Input Undervoltage Lockout ON Threshold 2.5 V
ON Threshold, −40°C ≤ TJ ≤ 125°C 2.65
OFF Threshold 2.35
OFF Threshold, −40°C ≤ TJ ≤ 125°C 2.1
ISS Soft-Start Pin Current(9) 11.3 µA
−40°C ≤ TJ ≤ 125°C 9 15
(1) Absolute maximum ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are conditions for which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.
(2) All voltages are with respect to the potential at the GND pin.
(3) This condition applies if VIN < VOUT. If VIN > VOUT, a voltage greater than VIN + 0.3 V should not be applied to the VOUT or SW pins. The absolute maximum specification applies to DC voltage. An extended negative voltage limit of –1 V applies for a pulse of up to 1 µs, and –2 V for a pulse of up to 40 ns. An extended positive voltage limit of 22 V applies for a pulse of up to 20 ns.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (Typ.) and disengages at TJ= 140°C (Typ.).
(5) For detailed soldering information and specifications, please refer to Application Note 1187: Leadless Leadframe Package (LLP) (SNOI401).
(6) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX)
(7) All room temperature limits are production tested, specified through statistical analysis or by design. All limits at −40°C ≤ TJ ≤ 125°C are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(8) Typical numbers are at 25°C and represent the most likely norm.
(9) Current flows out of the pin.
(10) Current flows into the pin.
(11) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

6.6 Typical Characteristics

LM4510SD, Circuit of Figure 18, (L = 4.7 µH, COILCRAFT, DO3316-472ML; CIN = 4 .7 µF, TDK, C2012X5R0J475K; COUT = 10 µF, AVX, 12103D106KAT2A; CS = 10 nF, TDK, C1608C0G1E103J; CC1 = 2.2 nF, Taiyo Yuden, TMK107SD222JA-T; RC = 46.4 kΩ, Yageo, 9t06031A4642FBHFT), VIN = 3.6 V, VOUT = 16 V, TA = 25°C, unless otherwise noted.
30031005.gifFigure 1. Switching Quiescent Current vs VIN
30031006.gifFigure 3. Load Capability vs VIN (VOUT = 16 V )
30031011.gifFigure 5. Switching Frequency vs Temperature
30031034.gifFigure 7. Load Regulation (VOUT = 5 V)
30031033.gif
Figure 9. Line Regulation (VOUT = 5 V)
30031004.pngFigure 11. Load Transient Response (VOUT = 16 V)
30031098.pngFigure 13. Output Voltage Ripple (VOUT = 16 V, IOUT = 90 mA)
30031035.gifFigure 2. RDS(on) vs Temperature at VIN= 3.6 V
30031010.gifFigure 4. Output Voltage vs Temperature (VOUT = 17 V)
30031012.gifFigure 6. Load Regulation (VOUT = 16 V)
30031029.gifFigure 8. Line Regulation (VOUT = 16 V)
30031003.pngFigure 10. Line Transient Response (VOUT = 16 V)
30031008.pngFigure 12. Short Circuit Response (VOUT = 16 V)
30031099.pngFigure 14. Output Voltage Ripple (VOUT = 5 V, IOUT = 100 mA)