SNVS181C April   2004  – August 2016 LM5033

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Voltage Start-Up Regulator (VIN and VCC)
      2. 7.3.2 Reference (REF)
      3. 7.3.3 PWM Comparator (COMP), Duty Cycle and Deadtime
      4. 7.3.4 Current Sense (CS)
      5. 7.3.5 Oscillator, Sync Capability (RT/SYNC)
      6. 7.3.6 Soft Start (SS)
      7. 7.3.7 OUT1 and OUT2
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VIN
        2. 8.2.2.2 VCC
        3. 8.2.2.3 Soft Start (SS)
        4. 8.2.2.4 Current Sense (CS)
        5. 8.2.2.5 Oscillator, Sync Input (RT/SYNC)
        6. 8.2.2.6 Deadtime Adjustment
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

see (1)
MIN MAX UNIT
VIN to GND –0.3 100 V
VCC to GND –0.3 16 V
RT/SYNC to GND –0.3 5.5 V
COMP, CS, and SS to GND –0.3 7 V
Power dissipation(2) Internally Limited
Maximum junction temperature, TJ(MAX) 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum allowable power dissipation is a function of the maximum allowed junction temperature (TJ(max)), the ambient temperature (TA), and the junction-to-ambient thermal resistance (θJA). The maximum allowable power dissipation can be calculated from PD = (TJ(max) – TA) / θJA. Excessive power dissipation causes the thermal shutdown to activate.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage 15 99 V
TJ Operating junction temperature -40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM5033 UNIT
DGS (VSSOP) DPR (WSON)
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 158 38.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.2 36.7 °C/W
RθJB Junction-to-board thermal resistance 78.1 15.2 °C/W
ψJT Junction-to-top characterization parameter 4.8 0.3 °C/W
ψJB Junction-to-board characterization parameter 76.8 15.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 4.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

VIN = 48 V, VCC = 10 V (applied externally), and RT = 26.7 kΩ, Typical limits are given for TJ = 25°C, Minimum and Maximum limits apply over TJ = –40°C to 125°C (unless otherwise noted).(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC STARTUP REGULATOR
VCCReg VCC voltage VCC is open 9.2 9.6 10 V
ICC(OUT) VCC current limit OUT1 and OUT2 disabled, extended supply to VCC disconnected 20 34 mA
IIN Startup regulator current into VIN Normal operation, VIN = 90 V 150 500 µA
Extended VCC supply disconnected, output load = 1800 pF 7 mA
VSS = 0 V 3 mA
UVT VCC undervoltage threshold (increasing VCC) VCCReg – 300 mV VCCReg – 100 mV V
UVT hysteresis (decreasing VCC) 2.3 2.8 3.3
ICC(IN) Supply current from external source to VCC VSS = 0 V 2 3 mA
SS is open, output load = 1800 pF 7
2.5-V REFERENCE
VREF Output voltage REF sink current = 5 mA 2.44 2.5 2.56 V
Current sink capability 5 13 mA
CURRENT SENSE
CS Threshold voltage 0.45 0.5 0.55 V
CS delay to output VCS taken from zero to 0.6 V, time for VOUT1 or VOUT2 to fall to 90% of VCC, CLOAD = 0 at OUT1 and OUT2 30 ns
Current sink capability (clocked) VCS ≤ 0.3 V 3 6 mA
SOFT START
Soft-start current source 7 10 13 µA
Soft-start to COMP offset 0.25 0.5 0.75 V
Open circuit voltage 5 V
OSCILLATOR
FS1 Internal frequency RT = 26.7 kΩ 175 200 225 kHz
FS2 Internal frequency RT = 8.2 kΩ 600 kHz
VSYNC Sync threshold 3.2 3.8 V
RT/SYNC DC voltage 2 V
PWM COMPARATOR INPUT
tPWM Gain from COMP to PWM comparator 0.34 V/V
Maximum duty cycle at OUT1 and OUT2 See PWM Comparator 100 × (0.5 tS – tD) / tS %
Minimum duty cycle at OUT1 and OUT2 VCOMP = 0 V 0%
Open circuit voltage 4.2 5.2 6.2 V
Short circuit current VCOMP = 0 V 0.6 1.1 1.5 mA
OUTPUT DRIVERS
tD Deadtime CLOAD = 0 at OUT1 and OUT2, time measured from 10% of falling output to 10% of rising output 85 135 185 ns
Rise time CLOAD = 1 nF 16 ns
Fall time CLOAD = 1 nF 16 ns
Output high voltage IOUT = 50 mA (source) VCC – 0.75 VCC – 0.25 V
Output low voltage IOUT = 100 mA (sink) 0.25 0.75 V
Maximum source current 1.5 A
Maximum sink current 1.5 A
THERMAL SHUTDOWN
tSD Shutdown temperature 165 °C
Shutdown temperature hysteresis 15 °C
(1) Minimum and maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI’s Average Outgoing Quality Level (AOQL).
(2) Typical specifications represent the most likely parametric norm at 25°C operation.

6.6 Typical Characteristics

LM5033 20035403.gif
Figure 1. VCC vs VIN
LM5033 20035405.gif
Figure 3. Oscillator Frequency vs RT
LM5033 20035407.gif Figure 5. Soft-Start Current vs Temperature
LM5033 20035409.gif
RT = 16.5 kΩ
Figure 7. Output Duty Cycle vs COMP Voltage
LM5033 20035411.gif
VCC powered externally
Figure 9. ICC vs VCC
LM5033 20035404.gif
VIN = 48 V
Figure 2. VCC vs ICC
LM5033 20035406.gif
RT = 26.7 kΩ
Figure 4. Oscillator Frequency vs Temperature
LM5033 20035408.gif Figure 6. Dead Time vs Temperature
LM5033 20035410.gif
Figure 8. VREF vs IREF
LM5033 20035412.gif
VCC not powered externally
Figure 10. IIN vs VIN