SNVS711J March   2011  – August 2015 LMZ23603

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Synchronization Input
      2. 7.3.2 Output Overvoltage Protection
      3. 7.3.3 Current Limit
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Prebiased Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Design Steps
        2. 8.2.2.2 Enable Divider, RENT, RENB and RENH Selection
        3. 8.2.2.3 Output Voltage Selection
        4. 8.2.2.4 Soft-Start Capacitor Selection
        5. 8.2.2.5 Tracking Supply Divider Option
        6. 8.2.2.6 CO Selection
        7. 8.2.2.7 CIN Selection
        8. 8.2.2.8 Discontinuous Conduction and Continuous Conduction Modes Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
    4. 10.4 Power Module SMT Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(3)(4)
MIN MAX UNIT
VIN to PGND –0.3 40 V
EN, SYNC to AGND –0.3 5.5 V
SS/TRK, FBto AGND –0.3 2.5 V
AGND to PGND –0.3 0.3 V
Junction Temperature 150 °C
Peak Reflow Case Temperature (30 sec) 245 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(4) For soldering specifications: see product folder at www.ti.com and SNOA549

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VIN 6 36 V
EN, SYNC 0 5 V
Operation Junction Temperature −40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LMZ23603 UNIT
NDW
7 PINS
RθJA Junction-to-ambient thermal resistance(2) 4-layer Evaluation Printed-Circuit-Board, 60 vias, No air flow 12.0 °C/W
2-layer JEDEC Printed-Circuit-Board, No air flow 21.5
RθJC(top) Junction-to-case (top) thermal resistance No air flow 1.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) RθJA measured on a 3.5-in × 3.5-in 4-layer board, with 3-oz. copper on outer layers and 2-oz. copper on inner layers, sixty thermal vias, no air flow, and 1-W power dissipation. Refer to PCB layout diagrams.

6.5 Electrical Characteristics

Limits are for TJ = 25°C unless otherwise specified. Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12V, VOUT = 3.3V
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SYSTEM PARAMETERS
ENABLE CONTROL
VEN EN threshold trip point VEN rising 1.279 V
over the junction temperature (TJ) range of –40°C to +125°C 1.1 1.458
VEN-HYS EN input hysteresis current VEN > 1.279 V –21 µA
SOFT-START
ISS SS source current VSS = 0 V 50 µA
over the junction temperature (TJ) range of –40°C to +125°C 40 60
tSS Internal soft-start interval 1.6 ms
CURRENT LIMIT
ICL Current limit threshold DC average over the junction temperature (TJ) range of –40°C to +125°C 3.4 A
INTERNAL SWITCHING OSCILLATOR
fosc Free-running oscillator frequency Sync input connected to ground. 711 812 914 kHz
fsync Synchronization range 650 950 kHz
VIL-sync Synchronization logic zero amplitude Relative to AGND over the junction temperature (TJ) range of –40°C to +125°C 0.4 V
VIH-sync Synchronization logic one amplitude Relative to AGND. over the junction temperature (TJ) range of –40°C to +125°C 1.5 V
Vsync DC Synchronization duty cycle range 15% 50% 85%
Dmax Maximum Duty Factor 83%
REGULATION AND OVERVOLTAGE COMPARATOR
VFB In-regulation feedback voltage VSS >+ 0.8 V
TJ = –40°C to 125°C
IO = 3 A		 0.796 V
over the junction temperature (TJ) range of –40°C to +125°C 0.776 0.816
VFB-OV Feedback overvoltage protection threshold 0.86 V
IFB Feedback input bias current 5 nA
IQ Non-switchinginput current VFB= 0.86 V 2.6 mA
ISD Shutdown quiescent current VEN= 0 V 70 μA
THERMAL CHARACTERISTICS
TSD Thermal shutdown Rising 165 °C
TSD-HYST Thermal shutdown hysteresis Falling 15 °C
PERFORMANCE PARAMETERS(3)
ΔVO Output voltage ripple Cout = 220 µF with 7-mΩ ESR + 100-µF X7R + 2 x 0.047-µF BW at 20 MHz 9 mVPP
ΔVO/ΔVIN Line regulation VIN = 12 V to 36 V, IO= 0.001 A ±0.02%
ΔVO/IOUT Load regulation VIN = 12 V, IO= 0.001 A to 3 A 1 mV/A
η Full load efficiency VIN = 12 V VO = 3.3 V, IO = 3 A 85%
VIN = 24 V VO = 3.3 V, IO = 3 A 78%
η Peak efficiency VIN = 24 V VO = 3.3 V, IO = 2 A 80%
VIN = 12 V VO = 3.3 V, IO = 1 A 86%
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI’s Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
(3) Refer to BOM in Table 1.

6.6 Typical Characteristics

Unless otherwise specified, the following conditions apply: VIN = 12 V; CIN = 2 x 10 μF + 1-μF X7R Ceramic; CO = 220-μF Specialty Polymer + 10-µF Ceramic; TA = 25°C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher output ripple – See Design Steps section.
LMZ23603 30152687.gif
Figure 1. Efficiency 6-V Output at 25°C Ambient
LMZ23603 30152652.gif
Figure 3. Efficiency 5-V Output at 25°C Ambient
LMZ23603 30152654.gif
Figure 5. Efficiency 3.3-V Output at 25°C Ambient
LMZ23603 30152656.gif
Figure 7. Efficiency 2.5-V Output at 25°C Ambient
LMZ23603 30152658.gif
Figure 9. Efficiency 1.8-V Output at 25°C Ambient
LMZ23603 30152660.gif
Figure 11. Efficiency 1.5-V Output at 25°C Ambient
LMZ23603 30152662.gif
Figure 13. Efficiency 1.2-V Output at 25°C Ambient
LMZ23603 30152664.gif
Figure 15. Efficiency 1-V Output at 25°C Ambient
LMZ23603 30152690.gif
Figure 17. Efficiency 0.8-V Output at 25°C Ambient
LMZ23603 30152626.gif
Figure 19. Efficiency 6-V Output at 85°C
LMZ23603 30152628.gif
Figure 21. Efficiency 5-V Output at 85°C Ambient
LMZ23603 30152630.gif
Figure 23. Efficiency 3.3-V Output at 85°C Ambient
LMZ23603 30152632.gif
Figure 25. Efficiency 2.5-V Output at 85°C Ambient
LMZ23603 30152634.gif
Figure 27. Efficiency 1.8-V Output at 85°C Ambient
LMZ23603 30152636.gif
Figure 29. Efficiency 1.5-V Output at 85°C Ambient
LMZ23603 30152638.gif
Figure 31. Efficiency 1.2-V Output at 85°C Ambient
LMZ23603 30152640.gif
Figure 33. Efficiency 1-V Output at 85°C Ambient
LMZ23603 30152692.gif
Figure 35. Efficiency 0.8-V Output at 85°C Ambient
LMZ23603 30152689.gif
VIN = 12 V, VOUT = 5 V
Figure 37. Thermal Derating
LMZ23603 30152696.gif
VIN = 24 V, VOUT = 5 V
Figure 39. Thermal Derating
LMZ23603 30152642.gif
VOUT = 3.3 V Normalized
Figure 41. Normalized Line and Load Regulation
LMZ23603 30152606.gif
12 VIN, 3.3 VO at 3 A BW = 250 MHz
Figure 43. Output Ripple from Evaluation Board
LMZ23603 30152618.gif
Figure 45. Short Circuit Current
LMZ23603 30152688.gif
Figure 2. Dissipation 6-V Output at 25°C Ambient
LMZ23603 30152653.gif
Figure 4. Dissipation 5-V Output at 25°C Ambient
LMZ23603 30152655.gif
Figure 6. Dissipation 3.3-V Output at 25°C Ambient
LMZ23603 30152657.gif
Figure 8. Dissipation 2.5-V Output at 25°C Ambient
LMZ23603 30152659.gif
Figure 10. Dissipation 1.8-V Output at 25°C Ambient
LMZ23603 30152661.gif
Figure 12. Dissipation 1.5-V Output at 25°C Ambient
LMZ23603 30152663.gif
Figure 14. Dissipation 1.2-V Output at 25°C Ambient
LMZ23603 30152665.gif
Figure 16. Dissipation 1-V Output at 25°C Ambient
LMZ23603 30152691.gif
Figure 18. Dissipation 0.8-V Output at 25°C Ambient
LMZ23603 30152627.gif
Figure 20. Dissipation 6-V Output at 85°C Ambient
LMZ23603 30152629.gif
Figure 22. Dissipation 5-V Output at 85°C Ambient
LMZ23603 30152631.gif
Figure 24. Dissipation 3.3-V Output at 85°C Ambient
LMZ23603 30152633.gif
Figure 26. Dissipation 2.5-V Output at 85°C Ambient
LMZ23603 30152635.gif
Figure 28. Dissipation 1.8-V Output at 85°C Ambient
LMZ23603 30152637.gif
Figure 30. Dissipation 1.5-V Output at 85°C Ambient
LMZ23603 30152639.gif
Figure 32. Dissipation 1.2-V Output at 85°C Ambient
LMZ23603 30152641.gif
Figure 34. Dissipation 1-V Output at 85°C Ambient
LMZ23603 30152693.gif
Figure 36. Dissipation 0.8-V Output at 85°C Ambient
LMZ23603 30152694.gif
VIN = 12 V, VOUT = 3.3 V
Figure 38. Thermal Derating
LMZ23603 30152697.gif
VIN = 24 V, VOUT = 3.3 V
Figure 40. Thermal Derating
LMZ23603 30152605.gif
12 VIN, 3.3 VO at 3 A, BW = 20 MHz
Figure 42. Output Ripple from Evaluation Board
LMZ23603 30152608.gif
12 VIN, 3.3 VO, 0.5- to 3-A Step
Figure 44. Transient Response from Evaluation Board