JAJSG73F August   2010  – September 2019 MSP430F5324 , MSP430F5325 , MSP430F5326 , MSP430F5327 , MSP430F5328 , MSP430F5329

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
    8. 5.8  Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    9. 5.9  Leakage Current – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
    10. 5.10 Outputs – General-Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
    11. 5.11 Outputs – General-Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
    12. 5.12 Output Frequency – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 5.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 5.16 Crystal Oscillator, XT2
    17. 5.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    18. 5.18 Internal Reference, Low-Frequency Oscillator (REFO)
    19. 5.19 DCO Frequency
    20. 5.20 PMM, Brownout Reset (BOR)
    21. 5.21 PMM, Core Voltage
    22. 5.22 PMM, SVS High Side
    23. 5.23 PMM, SVM High Side
    24. 5.24 PMM, SVS Low Side
    25. 5.25 PMM, SVM Low Side
    26. 5.26 Wake-up Times From Low-Power Modes and Reset
    27. 5.27 Timer_A
    28. 5.28 Timer_B
    29. 5.29 USCI (UART Mode) Clock Frequency
    30. 5.30 USCI (UART Mode)
    31. 5.31 USCI (SPI Master Mode) Clock Frequency
    32. 5.32 USCI (SPI Master Mode)
    33. 5.33 USCI (SPI Slave Mode)
    34. 5.34 USCI (I2C Mode)
    35. 5.35 12-Bit ADC, Power Supply and Input Range Conditions
    36. 5.36 12-Bit ADC, Timing Parameters
    37. 5.37 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
    38. 5.38 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
    39. 5.39 12-Bit ADC, Temperature Sensor and Built-In VMID
    40. 5.40 REF, External Reference
    41. 5.41 REF, Built-In Reference
    42. 5.42 Comparator B
    43. 5.43 Ports PU.0 and PU.1
    44. 5.44 LDO-PWR (LDO Power System)
    45. 5.45 Flash Memory
    46. 5.46 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU (Link to User's Guide)
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to User's Guide)
    8. 6.8  RAM (Link to User's Guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to User's Guide)
      2. 6.9.2  Port Mapping Controller (Link to User's Guide)
      3. 6.9.3  Oscillator and System Clock (Link to User's Guide)
      4. 6.9.4  Power-Management Module (PMM) (Link to User's Guide)
      5. 6.9.5  Hardware Multiplier (MPY) (Link to User's Guide)
      6. 6.9.6  Real-Time Clock (RTC_A) (Link to User's Guide)
      7. 6.9.7  Watchdog Timer (WDT_A) (Link to User's Guide)
      8. 6.9.8  System Module (SYS) (Link to User's Guide)
      9. 6.9.9  DMA Controller (Link to User's Guide)
      10. 6.9.10 Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
      11. 6.9.11 TA0 (Link to User's Guide)
      12. 6.9.12 TA1 (Link to User's Guide)
      13. 6.9.13 TA2 (Link to User's Guide)
      14. 6.9.14 TB0 (Link to User's Guide)
      15. 6.9.15 Comparator_B (Link to User's Guide)
      16. 6.9.16 ADC12_A (Link to User's Guide)
      17. 6.9.17 CRC16 (Link to User's Guide)
      18. 6.9.18 REF Voltage Reference (Link to User's Guide)
      19. 6.9.19 Embedded Emulation Module (EEM) (Link to User's Guide)
      20. 6.9.20 Peripheral File Map
    10. 6.10 Input/Output Diagrams
      1. 6.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.10.3  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      4. 6.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 6.10.6  Port P5 (P5.2) Input/Output With Schmitt Trigger
      7. 6.10.7  Port P5 (P5.3) Input/Output With Schmitt Trigger
      8. 6.10.8  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      9. 6.10.9  Port P5 (P5.6 to P5.7), Input/Output With Schmitt Trigger
      10. 6.10.10 Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      11. 6.10.11 Port P7 (P7.0 to P7.3) Input/Output With Schmitt Trigger
      12. 6.10.12 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
      13. 6.10.13 Port P8 (P8.0 to P8.2) Input/Output With Schmitt Trigger
      14. 6.10.14 Port U (PU.0 and PU.1)
      15. 6.10.15 Port J (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      16. 6.10.16 Port J (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 6.11 Device Descriptors
  7. 7デバイスおよびドキュメントのサポート
    1. 7.1  使い始めと次の手順
    2. 7.2  Device Nomenclature
    3. 7.3  ツールとソフトウェア
    4. 7.4  ドキュメントのサポート
    5. 7.5  関連リンク
    6. 7.6  Community Resources
    7. 7.7  商標
    8. 7.8  静電気放電に関する注意事項
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

2 改訂履歴

リビジョン E からリビジョン F への変更点

Changes from September 26, 2018 to September 23, 2019

  • Added the note "TI recommends connecting the exposed thermal pad to VSS" to Figure 4-2, 64-Pin RGC Package (Top View) – MSP430F5328IRGC, MSP430F5326IRGC, MSP430F5324IRGCGo
  • Added a row for the QFN thermal pad to Table 4-1, Signal DescriptionsGo

Changes from February 27, 2013 to September 25, 2018

  • ドキュメント全体を通して構造および構成を変更、セクションの番号追加も含むGo
  • Section 1.2「アプリケーション」を追加Go
  • 「製品情報」表を追加Go
  • Section 1.4を追加し、すべての機能ブロック図をこのセクションに移動Go
  • Added Section 3.1, Related ProductsGo
  • Added signal names to the ZQE pinoutGo
  • Added "Port U is supplied by the LDOO rail" to the PU.0 and PU.1 descriptions in Table 4-1, Signal DescriptionsGo
  • Added note to RST/NMI/SBWTDIO pinGo
  • Added typical conditions statements at the beginning of Section 5, SpecificationsGo
  • Added Section 5, Specifications, and moved all electrical specifications to itGo
  • Added Section 5.2, ESD RatingsGo
  • Added note to CVCOREGo
  • Moved Section 5.6, Thermal Resistance CharacteristicsGo
  • Added note to RPullGo
  • Changed the TYP value of the CL,eff parameter with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pF in Section 5.15, Crystal Oscillator, XT1, Low-Frequency ModeGo
  • Changed the MIN value of the V(DVCC_BOR_hys) parameter from 60 mV to 50 mV in Section 5.20, PMM, Brownout Reset (BOR)Go
  • Updated notes (1) and (2) and added note (3) in Section 5.26, Wake-up Times From Low-Power Modes and ResetGo
  • Removed ADC12DIV from the formula for the TYP value in the second row of the tCONVERT parameter in Section 5.36, 12-Bit ADC, Timing Parameters, because ADC12CLK is after divisionGo
  • For the tEN_CMP parameter in Section 5.42, Comparator_B: Changed the Test Condition of the first row from "CBPWRMD = 00, 01, 10" to "CBPWRMD = 00, 01"; Added a second row with Test Conditions of "CBPWRMD = 10" and MAX value of 100 µsGo
  • Changed all instances of "bootstrap loader" to "bootloader" throughout documentGo
  • Corrected spelling of NMIIFG in Table 6-8, System Module Interrupt Vector RegistersGo
  • Changed Table 6-56, Port PU.0, PU.1 FunctionsGo
  • Section 7「デバイスおよびドキュメントのサポート」セクションを追加し、「デバイスの項目表記」、「ESDの注意事項」、「商標」セクションをこのセクションに移動Go
  • 従来の「ツールのサポート」をSection 7.3「ツールとソフトウェア」に置き換えGo
  • Section 8「メカニカル、パッケージ、および注文情報」を追加Go