JAJSG11F October   2014  – December 2021 MSP430FR4131 , MSP430FR4132 , MSP430FR4133

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. 機能ブロック図
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Signal Descriptions
    3. 7.3 Pin Multiplexing
    4. 7.4 Connection of Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Active Mode Supply Current Per MHz
    6. 8.6  Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 8.7  Low-Power Mode LPM3, LPM4 Supply Currents (Into VCC) Excluding External Current
    8. 8.8  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 8.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 8.10 Current Consumption Per Module
    11. 8.11 Thermal Characteristics
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1  Power Supply Sequencing
        1. 8.12.1.1 PMM, SVS and BOR
      2. 8.12.2  Reset Timing
        1. 8.12.2.1 Wake-up Times From Low-Power Modes and Reset
      3. 8.12.3  Clock Specifications
        1. 8.12.3.1 XT1 Crystal Oscillator (Low Frequency)
        2. 8.12.3.2 DCO FLL, Frequency
        3. 8.12.3.3 REFO
        4. 8.12.3.4 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. 8.12.3.5 Module Oscillator Clock (MODCLK)
      4. 8.12.4  Digital I/Os
        1. 8.12.4.1 Digital Inputs
        2. 8.12.4.2 Digital Outputs
        3. 8.12.4.3 Digital I/O Typical Characteristics
      5. 8.12.5  Timer_A
        1. 8.12.5.1 Timer_A
      6. 8.12.6  eUSCI
        1. 8.12.6.1 eUSCI (UART Mode) Operating Frequency
        2. 8.12.6.2 eUSCI (UART Mode) Switching Characteristics
        3. 8.12.6.3 eUSCI (SPI Master Mode) Operating Frequency
        4. 8.12.6.4 eUSCI (SPI Master Mode) Switching Characteristics
        5. 8.12.6.5 eUSCI (SPI Slave Mode) Switching Characteristics
        6. 8.12.6.6 eUSCI (I2C Mode) Switching Characteristics
      7. 8.12.7  ADC
        1. 8.12.7.1 ADC, Power Supply and Input Range Conditions
        2. 8.12.7.2 ADC, 10-Bit Timing Parameters
        3. 8.12.7.3 ADC, 10-Bit Linearity Parameters
      8. 8.12.8  LCD Controller
        1. 8.12.8.1 LCD Recommended Operating Conditions
      9. 8.12.9  FRAM
        1. 8.12.9.1 FRAM
      10. 8.12.10 Emulation and Debug
        1. 8.12.10.1 JTAG and Spy-Bi-Wire Interface
  9. Detailed Description
    1. 9.1  CPU
    2. 9.2  Operating Modes
    3. 9.3  Interrupt Vector Addresses
    4. 9.4  Bootloader (BSL)
    5. 9.5  JTAG Standard Interface
    6. 9.6  Spy-Bi-Wire Interface (SBW)
    7. 9.7  FRAM
    8. 9.8  Memory Protection
    9. 9.9  Peripherals
      1. 9.9.1  Power Management Module (PMM) and On-Chip Reference Voltages
      2. 9.9.2  Clock System (CS) and Clock Distribution
      3. 9.9.3  General-Purpose Input/Output Port (I/O)
      4. 9.9.4  Watchdog Timer (WDT)
      5. 9.9.5  System Module (SYS)
      6. 9.9.6  Cyclic Redundancy Check (CRC)
      7. 9.9.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 9.9.8  Timers (Timer0_A3, Timer1_A3)
      9. 9.9.9  Real-Time Clock (RTC) Counter
      10. 9.9.10 10-Bit Analog Digital Converter (ADC)
      11. 9.9.11 Liquid Crystal Display (LCD)
      12. 9.9.12 Embedded Emulation Module (EEM)
      13. 9.9.13 Input/Output Schematics
        1. 9.9.13.1  Port P1 Input/Output With Schmitt Trigger
        2. 9.9.13.2  Port P2 Input/Output With Schmitt Trigger
        3. 9.9.13.3  Port P3 Input/Output With Schmitt Trigger
        4. 9.9.13.4  Port P4.0 Input/Output With Schmitt Trigger
        5. 9.9.13.5  Port P4.1 and P4.2 Input/Output With Schmitt Trigger
        6. 9.9.13.6  Port 4.3, P4.4, P4.5, P4.6, and P4.7 Input/Output With Schmitt Trigger
        7. 9.9.13.7  Port P5.0, P5.1, P5.2, and P5.3 Input/Output With Schmitt Trigger
        8. 9.9.13.8  Port P5.4, P5.5, P5.6, and P5.7 Input/Output With Schmitt Trigger
        9. 9.9.13.9  Port P6 Input/Output With Schmitt Trigger
        10. 9.9.13.10 Port P7 Input/Output With Schmitt Trigger
        11. 9.9.13.11 Port P8.0 and P8.1 Input/Output With Schmitt Trigger
        12. 9.9.13.12 Port P8.2 and P8.3 Input/Output With Schmitt Trigger
    10. 9.10 Device Descriptors (TLV)
    11. 9.11 Memory
      1. 9.11.1 Peripheral File Map
    12. 9.12 Identification
      1. 9.12.1 Revision Identification
      2. 9.12.2 Device Identification
      3. 9.12.3 JTAG Identification
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 External Oscillator
      3. 10.1.3 JTAG
      4. 10.1.4 Reset
      5. 10.1.5 Unused Pins
      6. 10.1.6 General Layout Recommendations
      7. 10.1.7 Do's and Don'ts
    2. 10.2 Peripheral- and Interface-Specific Design Information
      1. 10.2.1 ADC Peripheral
        1. 10.2.1.1 Partial Schematic
        2. 10.2.1.2 Design Requirements
        3. 10.2.1.3 Layout Guidelines
      2. 10.2.2 LCD_E Peripheral
        1. 10.2.2.1 Partial Schematic
        2. 10.2.2.2 Design Requirements
        3. 10.2.2.3 Detailed Design Procedure
        4. 10.2.2.4 Layout Guidelines
      3. 10.2.3 Timer
        1. 10.2.3.1 Generate Accurate PWM Using Internal Oscillator
    3. 10.3 Typical Applications
  11. 11Device and Documentation Support
    1. 11.1 Getting Started
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 サポート・リソース
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Detailed Design Procedure

A major component in designing the LCD solution is determining the exact connections between the LCD_E peripheral module and the display itself. Two basic design processes can be employed for this step, although often a balanced co-design approach is recommended:

  • PCB layout-driven design
  • Software-driven design

In the PCB layout-driven design process, LCD_E offers configurable segment Sx and common COMx signals which are connected to the respective MSP430 device pins so that the routing of the PCB can be optimized to minimize signal crossings and to keep signals on one side of the PCB only, typically the top layer. For example, using a multiplexed LCD, it is possible to arbitrarily connect the Sx and COMx signals between the LCD and the MSP430 device as long as segment lines are swapped with segment lines and common lines are swapped with common lines. It is also possible to not contiguously connect all segment lines but rather skip LCD_E module segment connections to optimize layout or to allow access to other functions that may be multiplexed on a particular device port pin. Employing a purely layout-driven design approach, however, can result in the LCD_E module control bits that are responsible for turning on and off segments to appear scattered throughout the memory map of the LCD controller (LCDMx registers). This approach potentially places a rather large burden on the software design that may also result in increased energy consumption due to the computational overhead required to work with the LCD.

The other extreme is a purely software-driven approach that starts with the idea that control bits for LCD segments that are frequently turned on and off together should be co-located in memory in the same LCDMx register or in adjacent registers. For example, in case of a 4-mux display that contains several 7-segment digits, from a software perspective it can be very desirable to control all 7 segments of each digit though a single byte-wide access to an LCDMx register. And consecutive segments are mapped to consecutive LCDMx registers. This allows use of simple look-up tables or software loops to output numbers on an LCD, reducing computational overhead and optimizing the energy consumption of an application. Establishing of the most convenient memory layout needs to be performed in conjunction with the specific LCD that is being used to understand its design constraints in terms of which segment and which common signals are connected to, for example, a digit.

For design information regarding the LCD controller input voltage selection including internal and external options, contrast control, and bias generation, see the LCD_E controller chapter in the MSP430FR4xx and MSP430FR2xx Family User's Guide.