JAJSJU5D October   2020  – December 2023 OPA3S328

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Diagram
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Switch Characterization Configurations
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Operating Voltage
      2. 7.3.2 Input and ESD Protection
      3. 7.3.3 Programmable Switches
      4. 7.3.4 Rail-to-Rail Input
      5. 7.3.5 Phase Reversal
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Load and Stability
      2. 8.1.2 EMI Susceptibility and Input Filtering
      3. 8.1.3 Transimpedance Amplifier
        1. 8.1.3.1 Optimizing the Transimpedance Circuit
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™シミュレーション・ソフトウェア (無償ダウンロード)
        3. 9.1.1.3 TI のリファレンス・デザイン
        4. 9.1.1.4 フィルタ設計ツール
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4.1 Layout Guidelines

The OPA3S328 contains two wideband amplifiers and an integrated charge pump. To realize the full operational performance of the device and remove the noise from the charge pump circuit, good high-frequency PCB layout practices must be employed. The bypass capacitors must be connected between each supply pin and ground as close to the device as possible. Additionally, in dual-supply systems, there must be a ceramic bypass capacitor between the supply pins. Use bypass capacitor traces designed for minimum inductance.