SCLS418H June   1998  – December 2014 SN74AHCT367

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Noise Characteristics
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DB|16
  • PW|16
  • D|16
  • DGV|16
サーマルパッド・メカニカル・データ
発注情報

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
VI Input voltage range(2) –0.5 7 V
VO Output voltage range(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±25 mA
Continuous current through VCC or GND ±75 mA
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN74AHCT367 UNIT
MIN MAX
VCC Supply voltage 4.5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level Input voltage 0.8 V
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current –8 mA
IOL Low-level output current 8 mA
Δt/Δv Input transition rise or fall rate 20 ns/V
TA Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

7.4 Thermal Information

THERMAL METRIC(1) SN74AHCT367 UNIT
D DB DGV PW
16 PINS
RθJA Junction-to-ambient thermal resistance 85.1 103.9 124.5 111.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.5 54.3 49.8 46.5
RθJB Junction-to-board thermal resistance 42.6 54.6 56.2 56.6
ψJT Junction-to-top characterization parameter 13.2 14.3 5.8 5.8
ψJB Junction-to-board characterization parameter 42.4 54.0 55.7 56.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C –40°C to 85°C –40°C to 125°C UNIT
MIN TYP MAX MIN MAX MIN MAX
VOH IOH = –50 µA 4.5 V 4.4 4.5 4.4 4.4 V
IOH = –8 mA 3.94 3.8 3.8
VOL IOL = 50 µA 4.5 V 0.1 0.1 0.1 V
IOH = 8 mA 0.36 0.44 0.44
II VI = 5.5 V or GND 0 V to
5.5 V
±0.1(1) ±1(1) ±1 µA
IOZ VO = VCC or GND
VI (OE) = VIL or VIH
5.5 V ±0.25 ±2.5 ±2.5 µA
ICC VI = VCC or GND, IO = 0 5.5 V 4 40 40 µA
ΔICC(2) One input at 3.4 V,
Other inputs at VCC or GND
5.5 V 1.35 1.5 1.5 mA
Ci VI = VCC or GND 5 V 2.5 10 10 10 pF
CO VO = VCC or GND 5 V 5 pF
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
(2) This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.

7.6 Switching Characteristics

over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
TA = 25°C –40°C to 85°C –40°C to 125°C UNIT
TYP MAX MIN MAX MIN MAX
tPLH A Y CL = 15 pF 2.5(1) 4.8(1) 1 6.5 1 8.5 ns
tPHL 2.5(1) 4.8(1) 1 6.5 1 8.5
tPZH OE Y CL = 15 pF 3.5(1) 8(1) 1 9.5 1 9 ns
tPZL 2.8(1) 7(1) 1 8.5(1) 1 8
tPHZ OE Y CL = 15 pF 3.1(1) 8(1) 1 9.5 1 9 ns
tPLZ 2.8(1) 7(1) 1 8.5 1 8
tPLH A Y CL = 50 pF 3.5 5.8 1 7.5 1 9.5 ns
tPHL 3.3 5.8 1 7.5 1 9.5
tPZH OE Y CL = 50 pF 4.5 9 1 10.5 1 10 ns
tPZL 3.7 8 1 9.5 1 9
tPHZ OE Y CL = 50 pF 4.1 9 1 10.5 1 10 ns
tPLZ 3.6 8 1 9.5 1 9
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.

7.7 Noise Characteristics

VCC = 5 V, CL = 50 pF, TA = 25°C(1)
PARAMETER SN74AHCT367 UNIT
MIN TYP MAX
VOL(P) Quiet output, maximum dynamic VOL 0.4 V
VOL(V) Quiet output, minimum dynamic VOL –0.4 V
VOH(V) Quiet output, minimum dynamic VOH 4.7 V
VIH(D) High-level dynamic input voltage 2 V
VIL(D) Low-level dynamic input voltage 0.8 V
(1) Characteristics are for surface-mount packages only.

7.8 Operating Characteristics

VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 22 pF

7.9 Typical Characteristics

D001_SCLS418.gifFigure 1. TPD vs Temperature, 50 pF Load