JAJSH74B December   2018  – April 2024 SN74AXC4T245

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7V
    7. 5.7  Switching Characteristics, VCCA = 0.8V
    8. 5.8  Switching Characteristics, VCCA = 0.9V
    9. 5.9  Switching Characteristics, VCCA = 1.2V
    10. 5.10 Switching Characteristics, VCCA = 1.5V
    11. 5.11 Switching Characteristics, VCCA = 1.8V
    12. 5.12 Switching Characteristics, VCCA = 2.5V
    13. 5.13 Switching Characteristics, VCCA = 3.3V
    14. 5.14 Operating Characteristics: TA = 25°C
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Standard CMOS Inputs
      2. 7.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3  Partial Power Down (Ioff)
      4. 7.3.4  VCC Isolation
      5. 7.3.5  Over-voltage Tolerant Inputs
      6. 7.3.6  Glitch-free Power Supply Sequencing
      7. 7.3.7  Negative Clamping Diodes
      8. 7.3.8  Fully Configurable Dual-Rail Design
      9. 7.3.9  I/Os with Integrated Static Pull-Down Resistors
      10. 7.3.10 Supports High-Speed Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PW|16
  • BQB|16
  • RSV|16
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) SN74AXC4T245 UNIT
PW (TSSOP) RSV (UQFN) BQB (WQFN)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 126.9 130.1 73.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49.3 70.3 35.1 °C/W
RθJB Junction-to-board thermal resistance 74.3 57.4 42.8 °C/W
ψJT Junction-to-top characterization parameter 8.1 4.6 4.6 °C/W
ψJB Junction-to-board characterization parameter 73.4 55.8 42.8 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance NA NA 10.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.