JAJSNJ0H December   1982  – December 2021 SN54HC574 , SN74HC574

PRODUCTION DATA  

  1. 1 特長
  2. 2 概要
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6. 5.6 Switching Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Operating Characteristics
  6. 6 Parameter Measurement Information
    1.     15
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
サーマルパッド・メカニカル・データ
発注情報

5.3 Thermal Information

THERMAL METRIC SN74HC574 UNIT
DW (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP)
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance(1) 109.1 122.7 84.6 113.4 131.8 °C/W
RθJC (top) Junction-to-case (top) thermal resistance 76 81.6 72.5 78.6 72.2 °C/W
RθJB Junction-to-board thermal resistance 77.6 77.5 65.3 78.4 82.8 °C/W
ΨJT Junction-to-top characterization parameter 51.5 46.1 55.3 47.1 21.5 °C/W
ΨJB Junction-to-board characterization parameter 77.1 77.1 65.2 78.1 82.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.