SLASF36 January   2024 TAC5311-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements: I2C Interface
    8. 5.8  Switching Characteristics: I2C Interface
    9. 5.9  Timing Requirements: TDM, I2S or LJ Interface
    10. 5.10 Switching Characteristics: TDM, I2S or LJ Interface
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
      2. 6.3.2  Using Multiple Devices With Shared Buses
      3. 6.3.3  Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4  Input Channel Configuration
      5. 6.3.5  Reference Voltage
      6. 6.3.6  Microphone Bias
      7. 6.3.7  Input DC Fault Diagnostics
        1. 6.3.7.1 Fault Conditions
          1. 6.3.7.1.1 Input Pin Short to Ground
          2. 6.3.7.1.2 Input Pin Short to MICBIAS
          3. 6.3.7.1.3 Open Inputs
          4. 6.3.7.1.4 Short Between INxP and INxM
          5. 6.3.7.1.5 Input Pin Overvoltage
          6. 6.3.7.1.6 Input Pin Short to VBAT_IN
        2. 6.3.7.2 Fault Reporting
          1. 6.3.7.2.1 Overcurrent and Overtemperature Protection
      8. 6.3.8  Signal-Chain Processing
        1. 6.3.8.1 ADC Signal-Chain
          1. 6.3.8.1.1 Programmable Channel Gain and Digital Volume Control
          2. 6.3.8.1.2 Programmable Channel Gain Calibration
          3. 6.3.8.1.3 Programmable Channel Phase Calibration
          4. 6.3.8.1.4 Programmable Digital High-Pass Filter
          5. 6.3.8.1.5 Programmable Digital Biquad Filters
          6. 6.3.8.1.6 Programmable Channel Summer and Digital Mixer
          7. 6.3.8.1.7 Configurable Digital Decimation Filters
            1. 6.3.8.1.7.1 Linear Phase Filters
              1. 6.3.8.1.7.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 6.3.8.1.7.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 6.3.8.1.7.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 6.3.8.1.7.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 6.3.8.1.7.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 6.3.8.1.7.1.6 Sampling Rate: 384kHz or 352.8kHz
      9. 6.3.9  DAC Signal-Chain
        1. 6.3.9.1 Programmable Channel Gain and Digital Volume Control
        2. 6.3.9.2 Programmable Channel Gain Calibration
        3. 6.3.9.3 Programmable Digital High-Pass Filter
        4. 6.3.9.4 Programmable Digital Biquad Filters
        5. 6.3.9.5 Programmable Digital Mixer
        6. 6.3.9.6 Configurable Digital Interpolation Filters
          1. 6.3.9.6.1 Linear Phase Filters
            1. 6.3.9.6.1.1 Sampling Rate: 16kHz or 14.7kHz
            2. 6.3.9.6.1.2 Sampling Rate: 24kHz or 22.05kHz
            3. 6.3.9.6.1.3 Sampling Rate: 32kHz or 29.4kHz
            4. 6.3.9.6.1.4 Sampling Rate: 48kHz or 44.1kHz
            5. 6.3.9.6.1.5 Sampling Rate: 96kHz or 88.2kHz
            6. 6.3.9.6.1.6 Sampling Rate: 384kHz or 352.8kHz
      10. 6.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
  8. 7 Register Maps
    1. 7.1 Page 0 Registers
    2. 7.2 Page 1 Registers
    3. 7.3 Page_3 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.7 Timing Requirements: I2C Interface

at TA = 25°C, IOVDD = 3.3 V or 1.8 V (unless otherwise noted); see TBD for timing diagram
MIN NOM MAX UNIT
STANDARD-MODE
fSCL SCL clock frequency 0 100 kHz
tHD;STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. 4 μs
tLOW Low period of the SCL clock 4.7 μs
tHIGH High period of the SCL clock 4 μs
tSU;STA Setup time for a repeated START condition 4.7 μs
tHD;DAT Data hold time 0 3.45 μs
tSU;DAT Data setup time 250 ns
tr SDA and SCL rise time 1000 ns
tf SDA and SCL fall time 300 ns
tSU;STO Setup time for STOP condition 4 μs
tBUF Bus free time between a STOP and START condition 4.7 μs
FAST-MODE
fSCL SCL clock frequency 0 400 kHz
tHD;STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. 0.6 μs
tLOW Low period of the SCL clock 1.3 μs
tHIGH High period of the SCL clock 0.6 μs
tSU;STA Setup time for a repeated START condition 0.6 μs
tHD;DAT Data hold time 0 0.9 μs
tSU;DAT Data setup time 100 ns
tr SDA and SCL rise time 20 300 ns
tf SDA and SCL fall time 20 × (IOVDD / 5.5 V) 300 ns
tSU;STO Setup time for STOP condition 0.6 μs
tBUF Bus free time between a STOP and START condition 1.3 μs
FAST-MODE PLUS
fSCL SCL clock frequency 0 1000 kHz
tHD;STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. 0.26 μs
tLOW Low period of the SCL clock 0.5 μs
tHIGH High period of the SCL clock 0.26 μs
tSU;STA Setup time for a repeated START condition 0.26 μs
tHD;DAT Data hold time 0 μs
tSU;DAT Data setup time 50 ns
tr SDA and SCL Rise Time 120 ns
tf SDA and SCL Fall Time 20 × (IOVDD / 5.5 V) 120 ns
tSU;STO Setup time for STOP condition 0.26 μs
tBUF Bus free time between a STOP and START condition 0.5 μs