SCPS233E March   2012  – February 2017 TCA9554

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 Interrupt Output (INT)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register and Command Byte
      3. 8.6.3 Register Descriptions
        1. 8.6.3.1 Bus Transactions
          1. 8.6.3.1.1 Writes
          2. 8.6.3.1.2 Reads
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Calculating Junction Temperature and Power Dissipation
        2. 9.2.1.2 Minimizing ICC when I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Supply voltage –0.5 6 V
VI Input voltage (2) –0.5 6 V
VO Output voltage (2) –0.5 6 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 –20 mA
IIOK Input-output clamp current VO < 0 or VO > VCC ±20 mA
IOL Continuous output low current through a single P-port VO = 0 to VCC 50 mA
IOH Continuous output high current through a single P-port VO = 0 to VCC –50 mA
ICC Continuous current through GND by all P-ports 250 mA
Continuous current through VCC –160
Tj(MAX) Maximum junction temperature 100 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 1.65 5.5 V
VIH High-level input voltage SCL, SDA VCC = 1.65 V to 5.5 V 0.7 × VCC VCC(1) V
A0, A1, A2, P7–P0 VCC = 1.65 V to 2.7 V 0.7 × VCC 5.5
VCC = 3 V to 5.5 V 0.8 × VCC 5.5
VIL Low-level input voltage SCL, SDA VCC = 1.65 V to 5.5 V –0.5 0.3 × VCC V
A0, A1, A2, P7–P0 VCC = 1.65 V to 2.7 V –0.5 0.3 × VCC
VCC = 3 V to 5.5 V –0.5 0.2 × VCC
IOL Low-level output current(2) P00–P07, P10–P17 Tj ≤ 65°C 25 mA
Tj ≤ 85°C 18
Tj ≤ 100°C 9
INT, SDA Tj ≤ 85°C 6
Tj ≤ 100°C 3
IOH High-level output current Any P-port, P7–P0 –10 mA
ICC Continuous current through GND All P-ports P7-P0, INT, and SDA 200 mA
Continuous current through VCC All P-ports P7-P0 –80
TA Operating free-air temperature –40 85 °C
(1) For voltages applied above VCC, an increase in ICC will result.
(2) The values shown apply to specific junction temperatures, which depend on the RθJA of the package used. See the Calculating Junction Temperature and Power Dissipation section on how to calculate the junction temperature.

6.4 Thermal Information

THERMAL METRIC(1) TCA9554 UNIT
PW (TSSOP) DBQ (SSOP) DB (SSOP) DW (SOIC)
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 122 121.7 113.2 84.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.4 72.9 63.6 48 °C/W
RθJB Junction-to-board thermal resistance 67.1 64.2 64 49.1 °C/W
ψJT Junction-to-top characterization parameter 10.8 24.4 21.2 22.7 °C/W
ψJB Junction-to-board characterization parameter 66.5 63.8 63.4 48.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VIK Input diode clamp voltage II = –18 mA 1.65 V to 5.5 V –1.2 V
VPORR Power-on reset voltage, VCC rising VI = VCC or GND, IO = 0 1.2 1.5 V
VPORF Power-on reset voltage, VCC falling VI = VCC or GND, IO = 0 0.75 1 V
VOH P-port high-level output voltage(2) IOH = –8 mA 1.65 V 1.2
2.3 V 1.8 V
3 V 2.6
4.5 V 4.1
IOH = –10 mA 1.65 V 1.1
2.3 V 1.7
3 V 2.5
4.5 V 4
IOL SDA(4) VOL = 0.4 V 1.65 V to 5.5 V 3 11 mA
P port(3) VOL = 0.5 V 1.65 V 8 10
2.3 V 8 13
3 V 8 15
4.5 V 8 17
VOL = 0.7 V 1.65 V 10 14
2.3 V 10 17
3 V 10 20
4.5 V 10 24
INT (5) VOL = 0.4 V 1.65 V to 5.5 V 3 7
II SCL, SDA VI = VCC or GND 1.65 V to 5.5 V ±1 µA
A0, A1, A2 ±1
IIH P port VI  = VCC 1.65 V to 5.5 V 1 µA
IIL P port VI  = GND 1.65 V to 5.5 V –100 µA
ICC Operating mode VI = VCC or GND, IO = 0, I/O = inputs,
fSCL = 400 kHz, no load, tr,max = 300 ns		 5.5 V 34 µA
3.6 V 15
2.7 V 9
1.65 V 5
Standby mode I/O = inputs,
fSCL = 0 kHz 		VI = VCC 5.5 V 1.9 3.5
3.6 V 1.1 1.8
2.7 V 1 1.6
1.95 V 0.4 1
VI = GND 5.5 V 0.45 0.7 mA
3.6 V 0.3 0.6
2.7 V 0.23 0.5
1.95 V 0.23 0.5
Ci SCL VI = VCC or GND 1.65 V to 5.5 V 3 8 pF
Cio SDA VIO = VCC or GND 1.65 V to 5.5 V 5.5 9.5 pF
P port 8 9.5
(1) All typical values are at nominal supply voltage (1.8-, 2.5-, 3.3-, or 5-V VCC) and TA = 25°C.
(2) Each P-port I/O configured as a high output must be externally limited to a maximum of 10 mA, and the total current sourced by all I/Os (P-ports P7-P0) through VCC must be limited to a maximum current of 80 mA.
(3) Each P-port I/O configured as a low output must be externally limited to a maximum of 25 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.
(4) The SDA pin must be externally limited to a maximum of 12 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.
(5) The INT pin must be externally limited to a maximum of 7 mA, and the total current sunk by all I/Os (P-ports P7-P0, INT, and SDA) through GND must be limited to a maximum current of 200 mA.

6.6 I2C Interface Timing Requirements

over operating free-air temperature range (unless otherwise noted) (see Figure 11)
MIN MAX UNIT
STANDARD MODE
fscl I2C clock frequency 0 100 kHz
tsch I2C clock high time 4 µs
tscl I2C clock low time 4.7 µs
tsp I2C spike time 50 ns
tsds I2C serial-data setup time 250 ns
tsdh I2C serial-data hold time 0 ns
ticr I2C input rise time 1000 ns
ticf I2C input fall time 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 300 ns
tbuf I2C bus free time between Stop and Start 4.7 µs
tsts I2C Start or repeated Start condition setup 4.7 µs
tsth I2C Start or repeated Start condition hold 4 µs
tsps I2C Stop condition setup 4 µs
tvd(data) Valid data time SCL low to SDA output valid 3.45 µs
tvd(ack) Valid data time of ACK condition ACK signal from SCL low to
SDA (out) low		 3.45 µs
Cb I2C bus capacitive load 400 pF
FAST MODE
fscl I2C clock frequency 0 400 kHz
tsch I2C clock high time 0.6 µs
tscl I2C clock low time 1.3 µs
tsp I2C spike time 50 ns
tsds I2C serial-data setup time 100 ns
tsdh I2C serial-data hold time 0 ns
ticr I2C input rise time 20 300 ns
ticf I2C input fall time 20 × (VDD / 5.5 V) 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 20 × (VDD / 5.5 V) 300 ns
tbuf I2C bus free time between Stop and Start 1.3 µs
tsts I2C Start or repeated Start condition setup 0.6 µs
tsth I2C Start or repeated Start condition hold 0.6 µs
tsps I2C Stop condition setup 0.6 µs
tvd(data) Valid data time 0.9 µs
tvd(ack) Valid data time of ACK condition 0.9 µs
Cb I2C bus capacitive load 400 pF

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted) (see Figure 12 and Figure 13)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 MIN MAX UNIT
STANDARD MODE and FAST MODE
tiv Interrupt valid time P port INT 4 µs
tir Interrupt reset delay time SCL INT 4 µs
tpv Output data valid SCL P7–P0 350 ns
tps Input data setup time P port SCL 100 ns
tph Input data hold time P port SCL 1 µs

6.8 Typical Characteristics

TA = 25°C (unless otherwise noted)
TCA9554 D001_SCPS199.gif
fSCL = 400 kHz I/Os = High or Low Inputs
Figure 1. Supply Current (ICC, Operating Mode) vs Temperature (TA) at Four Supply Voltages
TCA9554 D003_SCPS199.gif
fSCL = 400 kHz I/Os = High or Low Inputs TA = 25°C
Figure 3. Supply Current (ICC, Operating Mode) vs Supply Voltage (VCC)
TCA9554 D005_SCPS199.gif
TA = 25°C
Figure 5. Sink Current (IOL) vs Output Low Voltage (VOL) for P-Ports at Four Supply Voltages
TCA9554 D007_SCPS199.gif
TA = 25°C
Figure 7. Source Current (IOH) vs Output High Voltage (VOH) for P-Ports at Four Supply Voltages
TCA9554 D001_SCPS233.gif
VCC = 5 V
Figure 9. Supply Current (ICC) vs Number of I/Os Held Low (#)
TCA9554 D002_SCPS199.gif
fSCL = 0 kHz I/Os = High Inputs
Figure 2. Supply Current (ICC, Standby Mode) vs Temperature (TA) at Four Supply Voltages
TCA9554 D004_SCPS199.gif
I/Os = High or Low Inputs
Figure 4. Output Low Voltage (VOL) vs Temperature (TA) for P-Port I/Os
TCA9554 D006_SCPS199.gif
Figure 6. Output High Voltage (VCC – VOH) vs Temperature (TA) for P-Ports
TCA9554 D008_SCPS199.gif
TA = 25°C
Figure 8. Output High Voltage (VOH) vs Supply Voltage (VCC) for P-Ports
TCA9554 D019_TCA9539.gif
Figure 10. Δ ICC vs Temperature for Different VCC
(VI = VCC – 0.6 V)