JAJSPJ6 December   2022 TCAN3403-Q1 , TCAN3404-Q1

ADVANCE INFORMATION  

  1. 1特長
  2. 2アプリケーション
  3. 3概要
  4. 4Revision History
  5. 5Device Comparison
  6. 6Pin Configuration and Functions
  7. 7Device and Documentation Support
    1. 7.1 ドキュメントの更新通知を受け取る方法
    2. 7.2 サポート・リソース
    3. 7.3 Trademarks
    4. 7.4 静電気放電に関する注意事項
    5. 7.5 用語集
  8. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Tape and Reel Information
    2. 8.2 Mechanical Data

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Pin Configuration and Functions

Figure 6-1 DDF Package, 8-Pin SOT-23
(Top View)
Figure 6-2 D Package, 8-Pin SOIC
(Top View)
Figure 6-3 DRB Package, 8-Pin VSON
(Top View)
Table 6-1 Pin Functions
PINS TYPE(1) DESCRIPTION
NAME NO.
TXD 1 Digital Input CAN transmit data input; integrated pull-up
GND 2 G Ground connection
VCC 3 Supply 3.3 V supply voltage
RXD 4 Digital Output CAN receive data output, tri-stated when device powered off
SHDN 5 Digital Input Device in ultra-low power shutdown mode if pin is high; integrated pull-down (TCAN3404-Q1 only)
VIO Supply I/O supply voltage (TCAN3403-Q1 only)
CANL 6 Bus I/O Low-level CAN bus input/output line
CANH 7 Bus I/O High-level CAN bus input/output line
STB 8 Digital Input Standby input for mode control; integrated pull-up
Thermal Pad (VSON only) Connect the thermal pad to any internal PCB ground plane using multiple vias for optimal thermal performance.
I = Input, O = Output, I/O = Input or Output, G = Ground.