JAJSO82 January   2024 THVD9491-SEP

ADVANCE INFORMATION  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings [IEC]
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Power Dissipation
    7. 5.7 Electrical Characteristics
    8. 5.8 Switching Characteristics: 20Mbps
    9. 5.9 Switching Characteristics: 50Mbps
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 ±70-V Fault Protection
      2. 7.3.2 Integrated IEC ESD and EFT Protection
      3. 7.3.3 Driver Overvoltage and Overcurrent Protection
      4. 7.3.4 Enhanced Receiver Noise Immunity
      5. 7.3.5 Receiver Fail-Safe Operation
      6. 7.3.6 Low-Power Shutdown Mode
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Transient Protection
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Switching Characteristics: 50Mbps

50-Mbps (SLR = 0) over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5 V, VIO = 3.3 V, unless otherwise noted. (1) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time RL = 54 Ω, CL = 50 pF
 
See Figure 6-3 1 3 7 ns
tPHL, tPLH Propagation delay 7 22 ns
tSK(P) Pulse skew, |tPHL – tPLH| 1 3 ns
tPHZ, tPLZ Disable time RE = X See Figure 6-4 and Figure 6-5 14 30 ns
tPZH, tPZL Enable time RE = 0 V  20 35 ns
tPZH, tPZL Enable time RE = VIO 1.9 4.4 μs
tSHDN Time to shutdown RE = VIO 50 500 ns
Receiver
tr, tf Output rise/fall time CL = 15 pF See Figure 6-6 1.5 6 ns
tPHL, tPLH Propagation delay 25 35 60 ns
tSK(P) Pulse skew, |tPHL – tPLH| 1 5 ns
tPHZ, tPLZ Disable time DE = X 12 25 ns
tPZH(1),
tPZL(1)
Enable time DE = VIO See Figure 6-7 50 82 ns
tPZH(2),
tPZL(2)
Enable time DE = 0 V See Figure 6-8 3 5 μs
tD(OFS) Delay to enter fail-safe operation CL = 15 pF See Figure 6-9 7 10 18 μs
tD(FSO) Delay to exit fail-safe operation 19 35 50 ns
tSHDN Time to shutdown DE = 0 V See Figure 6-8 50 500 ns
A, B are driver output and receiver input terminals for Half duplex devices. A, B are RX input, Y/Z are driver output terminals for Full duplex device