4 Revision History
Changes from Revision L (July 2021) to Revision M (December 2021)
- Corrected DCK pinout diagram and table in Pin Configurations and
Functions sectionGo
Changes from Revision K (June 2021) to Revision L (July 2021)
- Deleted preview note from TL081H SOIC (8), SOT-23 (5), and SC70 (5) packages
throughout the data sheetGo
Changes from Revision J (November 2020) to Revision K (June 2021)
- Deleted VSSOP (8) package references throughout data sheetGo
- Deleted preview note from TL082H SOIC (8), SOT-23 (8), and TSSOP (8)
packages throughout the data sheetGo
- Added DBV, DCK, and D packages to TL081H in Pin Configuration and
Functions sectionGo
- Added ESD information for TL082HGo
- Added D, DCK, and DBV package thermal information in Thermal Information for Single Channel: TL081H sectionGo
- Added D, DDF, and PW package thermal information in Thermal Information for Dual Channel: TL082H section Go
- Added IB and IOS specification for single channel DCK and DBV packageGo
- Added IQ spec for TL081H and TL082HGo
- Removed Related Links section from Device and Documentation
Support sectionGo
Changes from Revision I (May 2015) to Revision J (November 2020)
- Updated the numbering format for tables, figures, and cross-references
throughout the documentGo
- Added TL08xH devices throughout the data sheetGo
- Added features for TL08xH to the Features sectionGo
- Added link to applications in the Applications
sectionGo
- Added TL08xH in the Description sectionGo
- Added TL08xH in the Device Information tableGo
- Updated pinout diagrams and pinout tables in Pin Configurations
and Functions section Go
- Added TSSOP, VSSOP and DDF packages to TL082x in Pin
Configuration and Functions sectionGo
- Added DYY package to TL084x in Pin Configuration and Functions
sectionGo
- Added Typical Characteristics:TL08xH section in Specifications
sectionGo
- Removed Table of Graphs in Typical Characteristics: All Other Devices
sectionGo
- Removed references to obsolete documentationGo
Changes from Revision H (January 2014) to Revision I (May 2015)
- Added Applications section, Device Information table, Pin
Functions table, Thermal Information table, Feature Description section, Device
Functional Modes section, Application and Implementation section, Power
Supply Recommendations section, ESD information, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable
Information sectionGo
- Added Applications
Go
- Moved Typical Characteristics into Specifications section. Go
Changes from Revision G (September 2004) to Revision H (January 2014)
- Deleted Ordering Information tableGo