JAJSN68 データシート

JAJSN68A october 2006 – may 2023 TLV3011-EP , TLV3012-EP

PRODUCTION DATA

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6.4 Thermal Resistance Characteristics

THERMAL METRIC^¹		TLV3011-EP	TLV3012-EP	UNIT
		DBV (SOT-23)	DBV (SOT-23)
		6 PINS	6 PINS
R _θJA	Junction-to-ambient thermal resistance	191.9	162.5	°C/W
R _θJC(top)	Junction-to-case (top) thermal resistance	123.9	78.8	°C/W
R _θJB	Junction-to-board thermal resistance	38.7	42.1	°C/W
ψ _JT	Junction-to-top characterization parameter	21.2	21.2	°C/W
ψ _JB	Junction-to-board characterization parameter	38.2	41.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics report.