JAJSGP0D December   2017  – July 2021 TLV767

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable
      2. 8.3.2 Dropout Voltage
      3. 8.3.3 Foldback Current Limit
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Output Pulldown
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Functional Mode Comparison
      2. 8.4.2 Normal Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Disabled
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Adjustable Device Feedback Resistors
      2. 9.1.2 Recommended Capacitor Types
      3. 9.1.3 Input and Output Capacitor Requirements
      4. 9.1.4 Reverse Current
      5. 9.1.5 Feed-Forward Capacitor (CFF)
      6. 9.1.6 Power Dissipation (PD)
      7. 9.1.7 Estimating Junction Temperature
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transient Response
        2. 9.2.2.2 Choose Feedback Resistors
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TLV767 UNIT
DBV (SOT23) DGN (HVSSOP) DRV (WSON)
5 PINS 8 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 165.7 60.1 77.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 61.6 81.7 92.3 °C/W
RθJB Junction-to-board thermal resistance 37.9 32.8 40.8 °C/W
ΨJT Junction-to-top characterization parameter 11.6 6 4.3 °C/W
ΨJB Junction-to-board characterization parameter 37.6 32.7 40.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 15.5 18.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.