JAJSHS8G June   2011  – May 2024 TPA6211A1-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
    1.     Pin Functions
    2. 4.1 DAPPER
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Dissipation Ratings
    8.     Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Advantages of Fully Differential Amplifiers
      2. 6.3.2 Fully Differential Amplifier Efficiency and Thermal Information
      3. 6.3.3 Differential Output Versus Single-Ended Output
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Differential Input Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Resistors (RI)
          2. 7.2.1.2.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 7.2.1.2.3 Input Capacitor (CI)
          4. 7.2.1.2.4 Band-Pass Filter (RI, CI, and CF)
            1. 7.2.1.2.4.1 Step 1: Low-Pass Filter
            2. 7.2.1.2.4.2 Step 2: High-Pass Filter
            3. 7.2.1.2.4.3 Step 3: Additional Low-Pass Filter
          5. 7.2.1.2.5 Decoupling Capacitor (CS)
          6. 7.2.1.2.6 Using Low-ESR Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Other Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling Capacitor
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 サポート・リソース
    3. 8.3 Trademarks
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 用語集
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per AEC Q100-002(1)±2000V
Charged-device model (CDM), per AEC Q100-011±1000
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.