JAJSM78F February   2012  – October 2021 TPD1E10B06

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.5 Thermal Information

THERMAL METRIC(1) TPD1E10B06 UNIT
DPY (X1SON) DYA (SOD523)
2 PINS 2 PINS
RθJA Junction-to-ambient thermal resistance 615.5 730.8  °C/W
RθJC(top) Junction-to-case (top) thermal resistance 404.8 413.4 °C/W
RθJB Junction-to-board thermal resistance 493.3 497.7 °C/W
ΨJT Junction-to-top characterization parameter 127.7 129.7 °C/W
ΨJB Junction-to-board characterization parameter 493.3 491.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 162 - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.