JAJSEZ1D December   2015  – December 2019 TPS2H000-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      代表的なアプリケーションの回路図
      2.      可変電流制限による容量性負荷の駆動
  4. 改訂履歴
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Current and Voltage Conventions
      2. 8.3.2 Accurate Current Sense
      3. 8.3.3 Adjustable Current Limit
      4. 8.3.4 Inductive-Load Switching-Off Clamp
      5. 8.3.5 Fault Detection and Reporting
        1. 8.3.5.1 Diagnostic Enable Function
        2. 8.3.5.2 Multiplexing of Current Sense
        3. 8.3.5.3 Fault Table
        4. 8.3.5.4 STx and FAULT Reporting
      6. 8.3.6 Full Diagnostics
        1. 8.3.6.1 Short-to-GND and Overload Detection
        2. 8.3.6.2 Open-Load Detection
          1. 8.3.6.2.1 Channel On
          2. 8.3.6.2.2 Channel Off
        3. 8.3.6.3 Short-to-Battery Detection
        4. 8.3.6.4 Reverse Polarity Detection
        5. 8.3.6.5 Thermal Fault Detection
          1. 8.3.6.5.1 Thermal Shutdown
      7. 8.3.7 Full Protections
        1. 8.3.7.1 UVLO Protection
        2. 8.3.7.2 Loss-of-GND Protection
        3. 8.3.7.3 Protection for Loss of Power Supply
        4. 8.3.7.4 Reverse-Current Protection
        5. 8.3.7.5 MCU I/O Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
      1. 11.2.1 Without a GND Network
      2. 11.2.2 With a GND Network
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Pin Configuration and Functions

PWP PowerPAD™ Package
16-Pin HTSSOP With Exposed Thermal Pad
TPS2H000-Q1 Version A Top View
NC – No internal connection
PWP PowerPAD Package
16-Pin HTSSOP With Exposed Thermal Pad
TPS2H000-Q1 Version B Top View
NC – No internal connection

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
VERSION A VERSION B
CL 7 7 O Adjustable current limit. Connect to device GND if external current limit is not used.
CS 6 O Current-sense output
DIAG_EN 3 3 I Enable-disable pin for diagnostics; internal pulldown
FAULT 4 O Global fault report with open-drain structure, ORed logic for dual-channel fault conditions
GND 8 8 Ground pin
IN1 1 1 I Input control for channel 1 activation; internal pulldown
IN2 2 2 I Input control for channel 2 activation; internal pulldown
NC 4, 10 10 No internal connection
ST1 5 O Open-drain diagnostic status output for channel 1
ST2 6 O Open-drain diagnostic status output for channel 2
SEL 5 I CS channel-selection bit; internal pulldown
THER 9 9 I Thermal shutdown behavior control, latch off or auto-retry; internal pulldown
OUT1 15, 16 15, 16 O Output of the channel 1 high side-switch, connected to the load
OUT2 11, 12 11, 12 O Output of the channel 2 high side-switch, connected to the load
VS 13, 14 13, 14 I Power supply
Thermal pad Connect to device GND or leave floating