SLVSFN6 December   2020 TPS54622-EP

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configurations and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency PWM Control
      2. 7.3.2  Continuous Current Mode Operation (CCM)
      3. 7.3.3  VIN and Power VIN Pins (VIN and PVIN)
      4. 7.3.4  Voltage Reference
      5. 7.3.5  Adjusting the Output Voltage
      6. 7.3.6  Safe Start-Up Into Prebiased Outputs
      7. 7.3.7  Error Amplifier
      8. 7.3.8  Slope Compensation
      9. 7.3.9  Enable and Adjusting Undervoltage Lockout
      10. 7.3.10 Adjustable Switching Frequency and Synchronization (RT/CLK)
      11. 7.3.11 Slow Start (SS/TR)
      12. 7.3.12 Power Good (PWRGD)
      13. 7.3.13 Output Overvoltage Protection (OVP)
      14. 7.3.14 Overcurrent Protection
        1. 7.3.14.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.14.2 Low-Side MOSFET Overcurrent Protection
      15. 7.3.15 Thermal Shutdown
      16. 7.3.16 Small Signal Model for Loop Response
      17. 7.3.17 Simple Small Signal Model for Peak Current Mode Control
      18. 7.3.18 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Adjustable Switching Frequency (RT Mode)
      2. 7.4.2 Synchronization (CLK Mode)
      3. 7.4.3 Bootstrap Voltage (BOOT) and Low Dropout Operation
      4. 7.4.4 Sequencing (SS/TR)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Operating Frequency
        3. 8.2.2.3  Output Inductor Selection
        4. 8.2.2.4  Output Capacitor Selection
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  Slow-Start Capacitor Selection
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  Undervoltage Lockout Setpoint
        9. 8.2.2.9  Output Voltage Feedback Resistor Selection
          1. 8.2.2.9.1 Minimum Output Voltage
        10. 8.2.2.10 Compensation Component Selection
        11. 8.2.2.11 Fast Transient Considerations
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Estimated Circuit Area
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
      2. 11.1.2 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Small Signal Model for Frequency Compensation

The device uses a transconductance amplifier for the error amplifier and readily supports two of the commonly used Type II compensation circuits and a Type III frequency compensation circuit, as shown in Figure 7-7. In Type 2A, one additional high-frequency pole, C6, is added to attenuate high frequency noise. In Type III, one additional capacitor, C11, is added to provide a phase boost at the crossover frequency. See Designing Type III Compensation for Current Mode Step-Down Converters for a complete explanation of Type III compensation.

The design guidelines below are provided for advanced users who prefer to compensate using the general method. The following equations only apply to designs whose ESR zero is above the bandwidth of the control loop. This is usually true with ceramic output capacitors. See Application and Implementation for a step-by-step design procedure using higher ESR output capacitors with lower ESR zero frequencies.

GUID-E081B442-9BB6-42AA-8C5F-00ABDB45652E-low.gifFigure 7-7 Types of Frequency Compensation

The general design guidelines for device loop compensation are as follows:

  1. Determine the crossover frequency, fc. A good starting point is 1/10th of the switching frequency, fsw.
  2. R4 can be determined by:
    Equation 9. GUID-B8C3AF11-254E-468B-B1B2-767C1936DE05-low.gif

    where

    • gmea is the GM amplifier gain (1300 μA/V).
    • gmps is the power stage gain (16 A/V).
    • Vref is the reference voltage (0.6 V).
  3. Place a compensation zero at the dominant pole: GUID-001A2EA8-61E1-49A4-BC9E-5F915C8B212D-low.gif
    C4 can be determined by:
    Equation 10. GUID-7E207B86-4AB9-43BD-BFA1-7301DD7B6460-low.gif
  4. C6 is optional. It can be used to cancel the zero from the equivalent series resistance (ESR) of the output capacitor CO.
    Equation 11. GUID-B6346D28-C128-4393-939E-A66561C6CC0F-low.gif
  5. Type III compensation can be implemented with the addition of one capacitor, C11. This allows for slightly higher loop bandwidths and higher phase margins. If used, C11 is calculated from Equation 12.
    Equation 12. GUID-FD94881A-8319-4C94-B65B-35999D8CD549-low.gif