JAJSN90A december   2022  – may 2023 TPS748A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics: IOUT = 50 mA
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Shutdown
      2. 7.3.2 Active Discharge
      3. 7.3.3 Power-Good Output (PG)
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Thermal Shutdown Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input, Output, and Bias Capacitor Requirements
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Output Noise
      4. 8.1.4 Estimating Junction Temperature
      5. 8.1.5 Soft Start, Sequencing, and Inrush Current
      6. 8.1.6 Power-Good Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DRC|10
サーマルパッド・メカニカル・データ
発注情報

8.1.4 Estimating Junction Temperature

By using the thermal metrics ΨJT and ΨJB, as shown in the Thermal Information table, the junction temperature can be estimated with corresponding formulas (given in Equation 6). For backwards compatibility, an older θJC(top) parameter is listed as well.

Equation 6. GUID-18FA9619-2DB8-4E71-BFEF-08352B6380E6-low.gif

where:

  • PD is the power dissipation
  • TT is the temperature at the center-top of the package
  • TB is the PCB temperature measured 1 mm away from the package on the PCB surface
Note: Both TT and TB can be measured on actual application boards using a thermo-gun (an infrared thermometer).

For more information about measuring TT and TB, see the Using New Thermal Metrics application note, available for download at www.ti.com.

For a more detailed discussion of why TI does not recommend using θJC(top) to determine thermal characteristics, see the Using New Thermal Metrics application note, available for download at www.ti.com. For further information, see the Semiconductor and IC Package Thermal Metrics application note, also available on the TI website.