JAJSI06A September   2019  – December 2020 TPSM82810 , TPSM82813

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Schematic
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Precise Enable (EN)
      2. 9.3.2 Output Discharge
      3. 9.3.3 COMP/FSET
      4. 9.3.4 MODE/SYNC
      5. 9.3.5 Spread Spectrum Clocking (SSC) - TPSM8281xS
      6. 9.3.6 Undervoltage Lockout (UVLO)
      7. 9.3.7 Power-Good Output (PG)
      8. 9.3.8 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Pulse Width Modulation (PWM) Operation
      2. 9.4.2 Power Save Mode Operation (PFM/PWM)
      3. 9.4.3 100% Duty-Cycle Operation
      4. 9.4.4 Current Limit and Short Circuit Protection
      5. 9.4.5 Soft Start / Tracking (SS/TR)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Programming the Output Voltage
        2. 10.2.2.2 Feedforward capacitor
        3. 10.2.2.3 Input Capacitor
        4. 10.2.2.4 Output Capacitor
        5. 10.2.2.5 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Voltage Tracking
      2. 10.3.2 Synchronizing to an External Clock
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
      1. 12.2.1 Thermal Consideration
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 サポート・リソース
    5. 13.5 Trademarks
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 用語集
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) TPSM8281x UNIT
µSiL (JEDEC 51-5)
14 PINS
RθJA Junction-to-ambient thermal resistance 52.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52 °C/W
RθJB Junction-to-board thermal resistance 16.9 °C/W
ψJT Junction-to-top characterization parameter 12.8 °C/W
ψJB Junction-to-board characterization parameter 16.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report and Section 12.3 - Thermal Consideration.