JAJSH41H March   2007  – August 2022 TS3A24159

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for 3-V Supply
    6. 6.6  Electrical Characteristics for 2.5-V Supply
    7. 6.7  Electrical Characteristics for 1.8-V Supply
    8. 6.8  Switching Characteristics for a 3-V Supply
    9. 6.9  Switching Characteristics for a 2.5-V Supply
    10. 6.10 Switching Characteristics for a 1.8-V Supply
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)TS3A24159UNIT
DGS (VSSOP)DRC (VSON)YZP (DSBGA)
10 PINS10 PINS10 PINS
RθJAJunction-to-ambient thermal resistance15449.490.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance37.971.20.3°C/W
RθJBJunction-to-board thermal resistance83.623.88.3°C/W
ψJTJunction-to-top characterization parameter1.42.23.2°C/W
ψJBJunction-to-board characterization parameter82.223.88.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A6.1N/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.