JAJSRH9A October   2023  – October 2023 TSM24B

PRODUCTION DATA  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings -JEDEC Specifications
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DBZ|3
サーマルパッド・メカニカル・データ
発注情報

Electrical Characteristics

At TA = 25°C unless otherwise noted
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VRWMReverse stand-off voltageIIO < 100 nA24V
ILEAKLeakage current at VRWMVIO = 24 V, I/O to GND2575nA
VBRBreakdown voltage, I/O to GND (1)IIO = 10 mA26.5V
VFWDForward Voltage, GND to I/O (1)IIO = 10 mA0.7V
VCLAMPSurge clamping voltage, tp = 8/20 µs (2)IPP = 20 A, I/O to GND33V
VCLAMPSurge clamping voltage, tp = 8/20 µs (2)IPP = 20 A, GND to I/O

6

8

V
CLINELine capacitance, IO to GNDVIO = 0 V, f = 1 MHz2437.5pF
VBR is defined as the voltage when 10 mA is applied in the positive-going direction.
Device stressed with 8/20 µs exponential decay waveform according to IEC 61000-4-5.