SWRS152N June 2013 – April 2021 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD
PRODUCTION DATA
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Figure 10-6 shows the recommended reflow profile for the WiLink 8 module.
Table 10-3 lists the temperature values for the profile shown in Figure 10-6.
ITEM | TEMPERATURE (°C) | TIME (s) |
---|---|---|
Preheat | D1 to approximately D2: 140 to 200 | T1: 80 to approximately 120 |
Soldering | D2: 220 | T2: 60 ±10 |
Peak temperature | D3: 250 maximum | T3: 10 |
TI does not recommend the use of conformal coating or similar material on the WiLink 8 module. This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Care should be taken during module assembly process to the final PCB to avoid the presence of foreign material inside the module.