DLPA078B February   2017  – September 2021 DLP160AP , DLP160CP , DLP2000 , DLP2010 , DLP230GP , DLP230KP , DLP230NP , DLP3010 , DLP3310 , DLP4710 , DLP471TP , DLPC3420 , DLPC3421

 

  1.   Trademarks
  2. 1 Introduction to Optical Modules
    1. 1.1 DLP Pico Chip or Digital Micromirror Device (DMD)
    2. 1.2 Illumination
    3. 1.3 llumination Optics
    4. 1.4 Projection Optics
    5. 1.5 Flash Memory Board
  3. 2 Use Case Considerations
    1. 2.1 Optical Module Specifications
  4. 3 Core Optical Module Specifications
    1. 3.1 Brightness
    2. 3.2 Size
    3. 3.3 Resolution
    4. 3.4 Illumination Power Consumption
    5. 3.5 Throw Ratio
    6. 3.6 Offset
    7. 3.7 Contrast Ratio
  5. 4 Additional Optical Module Specifications
    1. 4.1 Brightness Uniformity
    2. 4.2 Focus Uniformity
    3. 4.3 Color Management
    4. 4.4 Illumination Type
    5. 4.5 Thermal Management
    6. 4.6 Optical Zoom
    7. 4.7 Depth of Focus
    8. 4.8 Focus Method
    9. 4.9 Automatic White Point Correction
  6. 5 Features Implemented in Software
    1. 5.1 Keystone Correction
    2. 5.2 DLP Image Processing Settings
    3. 5.3 DLP IntelliBright Algorithms
  7. 6 Hardware Integration Considerations
    1. 6.1 Flash Memory
    2. 6.2 DLP Controller to DMD Interface
    3. 6.3 Flash Memory to DLP Controller Interface
  8. 7 Business Considerations
    1. 7.1 Cost
    2. 7.2 Custom Optical Modules
    3. 7.3 Minimum Order Quantity (MOQ)
    4. 7.4 Lead Times
  9. 8 Example Optical Module Specification Table
  10. 9 Get Started with Development
  11. 10Revision History

2.1 Optical Module Specifications

It is helpful to divide optical module specifications into two categories. Core specifications are the ones most commonly used to define the performance and characteristics of an optical module. Additional specifications are less commonly used but may be critical for certain applications. It is recommended to carefully consider all possible specifications when defining optical module requirements.