SBAA275A June   2018  – March 2023 ADS1120 , ADS112C04 , ADS112U04 , ADS1147 , ADS1148 , ADS114S06 , ADS114S06B , ADS114S08 , ADS114S08B , ADS1220 , ADS122C04 , ADS122U04 , ADS1247 , ADS1248 , ADS124S06 , ADS124S08 , ADS125H02 , ADS1260 , ADS1261 , ADS1262 , ADS1263

 

  1.   A Basic Guide to RTD Measurements
  2. 1RTD Overview
    1. 1.1 Callendar-Van Dusen Equation
    2. 1.2 RTD Tolerance Standards
    3. 1.3 RTD Wiring Configurations
    4. 1.4 Ratiometric Measurements
      1. 1.4.1 Lead Resistance Cancellation
      2. 1.4.2 IDAC Current Chopping
    5. 1.5 Design Considerations
      1. 1.5.1 Identify the RTD Range of Operation
      2. 1.5.2 Set the Excitation Current Sources and Consider RTD Self Heating
      3. 1.5.3 Set Reference Voltage and PGA Gain
      4. 1.5.4 Verify the Design Fits the Device Range of Operation
      5. 1.5.5 Design Iteration
  3. 2RTD Measurement Circuits
    1. 2.1  Two-Wire RTD Measurement With Low-Side Reference
      1. 2.1.1 Schematic
      2. 2.1.2 Pros and Cons
      3. 2.1.3 Design Notes
      4. 2.1.4 Measurement Conversion
      5. 2.1.5 Generic Register Settings
    2. 2.2  Two-Wire RTD Measurement With High-Side Reference
      1. 2.2.1 Schematic
      2. 2.2.2 Pros and Cons
      3. 2.2.3 Design Notes
      4. 2.2.4 Measurement Conversion
      5. 2.2.5 Generic Register Settings
    3. 2.3  Three-Wire RTD Measurement, Low-Side Reference
      1. 2.3.1 Schematic
      2. 2.3.2 Pros and Cons
      3. 2.3.3 Design Notes
      4. 2.3.4 Measurement Conversion
      5. 2.3.5 Generic Register Settings
      6. 2.3.6 Chopping IDAC Currents for Matching
    4. 2.4  Three-Wire RTD Measurement, Low-Side Reference, One IDAC Current Source
      1. 2.4.1 Schematic
      2. 2.4.2 Pros and Cons
      3. 2.4.3 Design Notes
      4. 2.4.4 Measurement Conversion
      5. 2.4.5 Configuration Register Settings
    5. 2.5  Three-Wire RTD Measurement, High-Side Reference
      1. 2.5.1 Schematic
      2. 2.5.2 Pros and Cons
      3. 2.5.3 Design Notes
      4. 2.5.4 Measurement Conversion
      5. 2.5.5 Configuration Register Settings
    6. 2.6  Four-Wire RTD Measurement, Low-Side Reference
      1. 2.6.1 Schematic
      2. 2.6.2 Pros and Cons
      3. 2.6.3 Design Notes
      4. 2.6.4 Measurement Conversion
      5. 2.6.5 Configuration Register Settings
    7. 2.7  Two Series Two-Wire RTD Measurements, Low-Side Reference
      1. 2.7.1 Schematic
      2. 2.7.2 Pros and Cons
      3. 2.7.3 Design Notes
      4. 2.7.4 Measurement Conversion
      5. 2.7.5 Configuration Register Settings
    8. 2.8  Two Series Four-Wire RTD Measurements
      1. 2.8.1 Schematic
      2. 2.8.2 Pros and Cons
      3. 2.8.3 Design Notes
      4. 2.8.4 Measurement Conversion
      5. 2.8.5 Configuration Measurement Settings
    9. 2.9  Multiple Two-Wire RTD Measurements
      1. 2.9.1 Schematic
      2. 2.9.2 Pros and Cons
      3. 2.9.3 Design Notes
      4. 2.9.4 Measurement Conversion
      5. 2.9.5 Configuration Register Settings
    10. 2.10 Multiple Three-Wire RTD Measurements
      1. 2.10.1 Schematic
      2. 2.10.2 Pros and Cons
      3. 2.10.3 Design Notes
      4. 2.10.4 Measurement Conversion
      5. 2.10.5 Configuration Register Settings
    11. 2.11 Multiple Four-Wire RTD Measurements in Parallel
      1. 2.11.1 Schematic
      2. 2.11.2 Pros and Cons
      3. 2.11.3 Design Notes
      4. 2.11.4 Measurement Conversion
      5. 2.11.5 Configuration Register Settings
    12. 2.12 Universal RTD Measurement Interface With Low-Side Reference
      1. 2.12.1 Schematic
      2. 2.12.2 Pros and Cons
      3. 2.12.3 Design Notes
        1. 2.12.3.1 Universal Measurement Interface - Two-Wire RTD
        2. 2.12.3.2 Universal Measurement Interface - Three-Wire RTD
        3. 2.12.3.3 Universal Measurement Interface - Four-Wire RTD
      4. 2.12.4 Measurement Conversion
        1. 2.12.4.1 Two-Wire Measurement
        2. 2.12.4.2 Three-Wire Measurement
        3. 2.12.4.3 Four-Wire Measurement
      5. 2.12.5 Configuration Register Settings
    13. 2.13 Universal RTD Measurement Interface With High-Side Reference
      1. 2.13.1 Schematic
      2. 2.13.2 Pros and Cons
      3. 2.13.3 Design Notes
        1. 2.13.3.1 Universal Measurement Interface, High-Side Reference - Two-Wire RTD
        2. 2.13.3.2 Universal Measurement Interface, High-Side Reference - Three-Wire RTD
        3. 2.13.3.3 Universal Measurement Interface, High-Side Reference - Four-Wire RTD
      4. 2.13.4 Measurement Conversion
        1. 2.13.4.1 Two-Wire Measurement
        2. 2.13.4.2 Three-Wire Measurement
        3. 2.13.4.3 Four-Wire Measurement
      5. 2.13.5 Configuration Register Settings
  4. 3Summary
  5. 4Revision History

Design Notes

Figure 2-10 shows a circuit topology measuring three three-wire RTDs. For each RTD, IDAC1 is used to drive lead 1 of the RTD, while IDAC2 is used to drive lead 2 of the RTD, used for lead wire compensation. All RTDs are joined together at lead 3 so that the IDAC currents are shunted to a common reference resistor.

The measurement circuit requires:

  • Two dedicated IDAC output pins and AINP and AINN inputs for each RTD measurement
  • External reference input
  • Precision reference resistor

The multiplexer isolates each RTD measurement. First IDAC1 is routed to AIN0 and IDAC2 is routed to AIN3 for the RTD1 measurement between AIN1 and AIN2. Aside from a small amount of input current for each analog pin, the connections to RTD2, RTD3, and RTD4 should have no bearing on the RTD1 measurement.

After measuring RTD1, IDAC1 is then routed to AIN4 and IDAC2 is routed to AIN7 to measure RTD2 between AIN5 and AIN6. Finally, IDAC1 is then routed to AIN8 and IDAC2 is routed to AIN11 to measure RTD2 between AIN9 and AIN10. Each RTD measurement requires four pins from the device. Two pins source the IDAC current for lead wire compensation, while the other two pins are the analog inputs used to measure the RTDs. The design is identical to the three-wire RTD measurement design in Section 2.3 outlined earlier.

Cycling from channel-to-channel, may require some delay to account for settling as the IDAC1 is routed to different RTDs. Even if the IDAC change is instantaneous, the IDAC currents are routed from AIN0 and AIN3, to AIN4 and AIN7, and to AIN8 and AIN11. This requires that the voltages from the RTDs settle through the input RC filter at the front end of the ADC. For most devices, this must be programmed in from the SPI master. For some devices, a built-in programmable delay can be used to insert a small time period to allow for input settling.

As mentioned in Section 2.3.6, chopping of the IDAC currents may be used to reduce the error associated with IDAC mismatch.