SFFS032 December   2022 TLV6001-Q1 , TLV6002-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SC70 Package
    2. 2.2 VSSOP Package
  4. 3Failure Mode Distribution (FMD)
  5.   7
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SC70 Package
    2. 4.2 VSSOP Package

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TLV600x-Q1 (SC70 and SOIC package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality
B No device damage, but loss of functionality
C No device damage, but performance degradation
D No device damage, no impact to functionality or performance