SFFS103 June   2021 TPS3710-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TPS3710-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the TPS3710-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPS3710-Q1 data sheet.

GUID-7891EF16-CCE2-41D1-9F18-62534B6EC5A1-low.gif Figure 4-1 DSE PackageWSON-6Top View

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Unless otherwise specified, it is assumed that the voltages applied to all the pins are within the Recommended Operating Range specified in the TPS3710-Q1 data sheet.
  • Note that the SENSE pin has lower maximum operating range than VDD and OUT.
  • For shorts to VDD, this document assumes the SENSE pin maximum is not exceeded.
  • Refer to Typical Application Circuit diagram in the datasheet for test layout.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. (DSE) Description of Potential Failure Effect(s) Failure Effect Class
GND 1 No effect. D
VDD 2 No damage to device, but device is unpowered. Device is nonfunctional. B
GND 3 No effect. D
SENSE 4 No damage to device, output always low. B
GND 5 No effect. D
OUT 6 No damage to device, output pin nonfunctional, increase in system current. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. (DSE) Description of Potential Failure Effect(s) Failure Effect Class
GND 1 No effect if at least one other GND pin is connected to GND. D
VDD 2 No damage to device, but device is unpowered. Device is nonfunctional. B
GND 3 No effect if at least one other GND pin is connected to GND. D
SENSE 4 No damage to device. Due to internal resistor ladder for setting trip points open SENSE pin behaves as though GND potential - output always low. B
GND 5 No effect if at least one other GND pin is connected to GND. D
OUT 6 No damage to device, output pin nonfunctional. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. (DSE) Shorted to Description of Potential Failure Effect(s) Failure Effect Class
GND 1 OUT No damage to device, output pin nonfunctional, increase in system current. B
VDD 2 GND No damage to device, but device is unpowered. Device is nonfunctional. B
GND 3 VDD No damage to device, but device is unpowered. Device is nonfunctional. B
SENSE 4 GND No damage to device, output always low. B
GND 5 SENSE No damage to device, output always low. B
OUT 6 GND No damage to device, output pin nonfunctional, increase in system current. B
Table 4-5 Pin FMA for Device Pins Short-Circuited to VDD
Pin Name Pin No. (DSE) Description of Potential Failure Effect(s) Failure Effect Class
GND 1 No damage to device, but device is unpowered. Device is nonfunctional. B
VDD 2 No effect. D
GND 3 No damage to device, but device is unpowered. Device is nonfunctional. B
SENSE 4 No damage to device, output always active. B
GND 5 No damage to device, but device is unpowered. Device is nonfunctional. B
OUT 6 No damage to device, output pin nonfunctional. B