SFFS236 June   2022 TMP75B-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC-8 Package
    2. 2.2 VSSOP-8 Package
  4. 3Failure Mode Distribution (FMD)

1 Overview

This document contains information for TMP75B-Q1 (SOIC-8 and VSSOP-8 package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device

Figure 1-1 shows the device functional block diagram for reference.

GUID-310576F7-ED4B-4579-862D-28D6F4D4BEDE-low.gifFigure 1-1 Functional Block Diagram

TMP75B-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.