SFFS258 August   2021 TPSM560R6

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

1 Overview

This document contains information for TPSM560R6 (B3QFN package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-0DBB679D-53FA-4BC8-A063-C82EA3C30BAC-low.png Figure 1-1 Functional Block Diagram

TPSM560R6 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.