SFFS752 November   2023 DRV8242-Q1

PRODMIX  

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 HW Variant in VQFN-RHL Package
    2. 4.2 SPI "S" and"P" Variant in VQFN-RHL Package

Overview

This document contains information for DRV8242-Q1 to aid in a functional safety system design. This document covers all the device package and interface variants as listed below:

  1. HW variant in VQFN-RHL package
  2. SPI "S" variant in VQFN-RHL package
  3. SPI "P" variant in VQFN-RHL package
Note: The DRV8242-Q1 HW (H) and SPI (P) variants are preview only, pre-production status.

Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA) for all the package and interface variants

Figure 1-1 shows the functional block diagram for the HW device variant reference.

GUID-20200821-CA0I-555N-FNNK-H2CZQ105DJTW-low.svg Figure 1-1 Functional Block Diagram for HW Variant

Figure 1-2 shows the functional block diagram for the SPI "S" device variant for reference.

GUID-20200811-CA0I-JMHV-RJHR-68F02XTJVL5L-low.svg Figure 1-2 Functional Block Diagram for SPI S Variant

Figure 1-3 shows the functional block diagram for the SPI "P" device variant for reference.

GUID-20210630-CA0I-QP61-WZNZ-6DN1T6DTRFWF-low.svg Figure 1-3 Functional Block Diagram for SPI P Variant

DRV8242-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

ADVANCE INFORMATION for preproduction products; subject to change without notice.