SLAA530B March   2012  – July 2021 MSP430F5131 , MSP430F5132 , MSP430F5151 , MSP430F5152 , MSP430F5171 , MSP430F5172 , MSP430F5212 , MSP430F5214 , MSP430F5217 , MSP430F5219 , MSP430F5222 , MSP430F5224 , MSP430F5229 , MSP430F5232 , MSP430F5234 , MSP430F5237 , MSP430F5239 , MSP430F5242 , MSP430F5244 , MSP430F5247 , MSP430F5249 , MSP430F5252 , MSP430F5253 , MSP430F5254 , MSP430F5255 , MSP430F5256 , MSP430F5257 , MSP430F5258 , MSP430F5259 , MSP430F5304 , MSP430F5308 , MSP430F5309 , MSP430F5310 , MSP430F5324 , MSP430F5325 , MSP430F5326 , MSP430F5327 , MSP430F5328 , MSP430F5328-EP , MSP430F5329 , MSP430F5333 , MSP430F5335 , MSP430F5336 , MSP430F5338 , MSP430F5340 , MSP430F5341 , MSP430F5342 , MSP430F5358 , MSP430F5359 , MSP430F5418 , MSP430F5418A , MSP430F5419 , MSP430F5419A , MSP430F5435 , MSP430F5435A , MSP430F5436 , MSP430F5436A , MSP430F5437 , MSP430F5437A , MSP430F5438 , MSP430F5438A , MSP430F5438A-EP , MSP430F5500 , MSP430F5501 , MSP430F5502 , MSP430F5503 , MSP430F5504 , MSP430F5505 , MSP430F5506 , MSP430F5507 , MSP430F5508 , MSP430F5509 , MSP430F5510 , MSP430F5513 , MSP430F5514 , MSP430F5515 , MSP430F5517 , MSP430F5519 , MSP430F5521 , MSP430F5522 , MSP430F5524 , MSP430F5525 , MSP430F5526 , MSP430F5527 , MSP430F5528 , MSP430F5529 , MSP430F5630 , MSP430F5631 , MSP430F5632 , MSP430F5633 , MSP430F5634 , MSP430F5635 , MSP430F5636 , MSP430F5637 , MSP430F5638 , MSP430F5658 , MSP430F5659 , MSP430F6433 , MSP430F6435 , MSP430F6436 , MSP430F6438 , MSP430F6458 , MSP430F6459 , MSP430F6459-HIREL , MSP430F6630 , MSP430F6631 , MSP430F6632 , MSP430F6633 , MSP430F6634 , MSP430F6635 , MSP430F6636 , MSP430F6637 , MSP430F6638 , MSP430F6658 , MSP430F6659 , MSP430F6720 , MSP430F6720A , MSP430F6721 , MSP430F6721A , MSP430F6723 , MSP430F6723A , MSP430F6724 , MSP430F6724A , MSP430F6725 , MSP430F6725A , MSP430F6726 , MSP430F6726A , MSP430F6730 , MSP430F6730A , MSP430F6731 , MSP430F6731A , MSP430F6733 , MSP430F6733A , MSP430F6734 , MSP430F6734A , MSP430F6735 , MSP430F6735A , MSP430F6736 , MSP430F6736A , MSP430F6745 , MSP430F67451 , MSP430F67451A , MSP430F6745A , MSP430F6746 , MSP430F67461 , MSP430F67461A , MSP430F6746A , MSP430F6747 , MSP430F67471 , MSP430F67471A , MSP430F6747A , MSP430F6748 , MSP430F67481 , MSP430F67481A , MSP430F6748A , MSP430F6749 , MSP430F67491 , MSP430F67491A , MSP430F6749A , MSP430F67621 , MSP430F67621A , MSP430F67641 , MSP430F67641A , MSP430F6765 , MSP430F67651 , MSP430F67651A , MSP430F6765A , MSP430F6766 , MSP430F67661 , MSP430F67661A , MSP430F6766A , MSP430F6767 , MSP430F67671 , MSP430F67671A , MSP430F6767A , MSP430F6768 , MSP430F67681 , MSP430F67681A , MSP430F6768A , MSP430F6769 , MSP430F67691 , MSP430F67691A , MSP430F6769A , MSP430F6775 , MSP430F67751 , MSP430F67751A , MSP430F6775A , MSP430F6776 , MSP430F67761 , MSP430F67761A , MSP430F6776A , MSP430F6777 , MSP430F67771 , MSP430F67771A , MSP430F6777A , MSP430F6778 , MSP430F67781 , MSP430F67781A , MSP430F6778A , MSP430F6779 , MSP430F67791 , MSP430F67791A , MSP430F6779A , MSP430FR2000 , MSP430FR2032 , MSP430FR2033 , MSP430FR2100 , MSP430FR2110 , MSP430FR2111 , MSP430FR2153 , MSP430FR2155 , MSP430FR2310 , MSP430FR2311 , MSP430FR2353 , MSP430FR2355 , MSP430FR2422 , MSP430FR2433 , MSP430FR2475 , MSP430FR2476 , MSP430FR2512 , MSP430FR2522 , MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633 , MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676 , MSP430FR4131 , MSP430FR4132 , MSP430FR4133 , MSP430FR5041 , MSP430FR5043 , MSP430FR50431 , MSP430FR5720 , MSP430FR5721 , MSP430FR5722 , MSP430FR5723 , MSP430FR5724 , MSP430FR5725 , MSP430FR5726 , MSP430FR5727 , MSP430FR5728 , MSP430FR5729 , MSP430FR5730 , MSP430FR5731 , MSP430FR5732 , MSP430FR5733 , MSP430FR5734 , MSP430FR5735 , MSP430FR5736 , MSP430FR5737 , MSP430FR5738 , MSP430FR5739 , MSP430FR5739-EP , MSP430FR5847 , MSP430FR58471 , MSP430FR5848 , MSP430FR5849 , MSP430FR5857 , MSP430FR5858 , MSP430FR5859 , MSP430FR5867 , MSP430FR58671 , MSP430FR5868 , MSP430FR5869 , MSP430FR5870 , MSP430FR5872 , MSP430FR58721 , MSP430FR5887 , MSP430FR5888 , MSP430FR5889 , MSP430FR58891 , MSP430FR5922 , MSP430FR59221 , MSP430FR5947 , MSP430FR59471 , MSP430FR5948 , MSP430FR5949 , MSP430FR5957 , MSP430FR5958 , MSP430FR5959 , MSP430FR5962 , MSP430FR5964 , MSP430FR5967 , MSP430FR5968 , MSP430FR5969 , MSP430FR5969-SP , MSP430FR59691 , MSP430FR5970 , MSP430FR5972 , MSP430FR59721 , MSP430FR5986 , MSP430FR5987 , MSP430FR5988 , MSP430FR5989 , MSP430FR5989-EP , MSP430FR59891 , MSP430FR5992 , MSP430FR5994 , MSP430FR59941 , MSP430FR6005 , MSP430FR6007 , MSP430FR6035 , MSP430FR6037 , MSP430FR60371 , MSP430FR6041 , MSP430FR6043 , MSP430FR60431 , MSP430FR6045 , MSP430FR6047 , MSP430FR60471 , MSP430FR6820 , MSP430FR6822 , MSP430FR68221 , MSP430FR6870 , MSP430FR6872 , MSP430FR68721 , MSP430FR6877 , MSP430FR6879 , MSP430FR68791 , MSP430FR6887 , MSP430FR6888 , MSP430FR6889 , MSP430FR68891 , MSP430FR6920 , MSP430FR6922 , MSP430FR69221 , MSP430FR6927 , MSP430FR69271 , MSP430FR6928 , MSP430FR6970 , MSP430FR6972 , MSP430FR69721 , MSP430FR6977 , MSP430FR6979 , MSP430FR69791 , MSP430FR6987 , MSP430FR6988 , MSP430FR6989 , MSP430FR69891

 

  1.   Trademarks
  2. 1Introduction to ESD
    1. 1.1 Component-Level ESD Rating
      1. 1.1.1 Human Body Model (HBM)
      2. 1.1.2 Charged Device Model (CDM)
    2. 1.2 System-Level ESD Rating
    3. 1.3 ESD Waveforms
  3. 2General System-Level ESD Design Guidelines
    1. 2.1 Enclosures
      1. 2.1.1 Enclosure Openings
      2. 2.1.2 Enclosure Cables
    2. 2.2 PCB Design and Layout
      1. 2.2.1 Example Layout – Current Loop
    3. 2.3 On-Board ESD Protection Devices
      1. 2.3.1 Simple Passive Components
      2. 2.3.2 ESD Suppression Devices
      3. 2.3.3 ESD Protection Using Series Resistor
    4. 2.4 Circuit Design and Software Considerations
      1. 2.4.1 Circuit Design
      2. 2.4.2 Software Considerations
    5. 2.5 ESD Testing
  4. 3System Efficient ESD Design (SEED)
    1. 3.1 System-Level ESD Protection Methodology
      1. 3.1.1 On-Board Protection – Primary Clamp
      2. 3.1.2 On-Chip Protection – Secondary Clamp
      3. 3.1.3 Two-Stage Protection – Fundamental SEED Concept
    2. 3.2 SPICE Simulation Methodology for System-Level ESD Design
  5. 4SEED-Based IEC Protection Design and Verification – Real World Example 1
    1. 4.1 Modeling IEC Stress Waveform
    2. 4.2 Modeling TVS Device
    3. 4.3 Modeling MSP430 I/O Pin
    4. 4.4 Isolated Impedance Calculation
    5. 4.5 SPICE Simulation – SEED Method
    6. 4.6 Board-Level Verification
  6. 5System-Level ESD Protection – Real World Example 2
  7. 6Summary
  8. 7Modeling Using TLP Parameters
    1. 7.1 Modeling TVS Device Using TLP Parameters [8]
    2. 7.2 Modeling IC Interface Pin to be Protected Using TLP Parameters [8]
  9. 8References
  10.   Revision History

Introduction to ESD

Static charge is an unbalanced electrical charge at rest. When two non-conductive materials are rubbed together or separated, there is gain of electrons on the surface of one material and loss on the other; this results in an unbalanced electrical conditions known as static charge. The voltage to which an object can be charged depends on the capacitance, following the law Q = CV. The human body can be charged to several kV. When this static charge moves from one surface to another, it is called ESD (Electrostatic Discharge). ESD is a single-event rapid transfer of electrostatic charge between two objects that are at different potentials. It can occur only when the voltage differential between the two objects is sufficiently high to break down the dielectric strength of the medium separating them. The rapid movement of the electrostatic charge generates current that damages or destroys gate oxide, metallization, and junctions within an integrated circuit (IC).

ESD can occur in any one of the four ways:

  • Charged body touching an IC
  • Charged IC touching a grounded surface or object
  • Charged metallic tool touching an IC
  • An electrostatic field inducing a voltage across a dielectric sufficient enough to break it down.

The coupling mechanisms in each of these cases are inductive, resistive, or capacitive. Creating an ESD-safe design is focused on minimizing ESD coupling by a combination of factors. To design an ESD robust product, it is important to understand that the ESD protection required at component or IC level and at system level are different.

Typically, silicon vendors design, test, and qualify their ICs according to industry standards to ensure no physical damage occurs during IC production or during assembly onto PCBs. The Original Equipment Manufacturer (OEM) should design ESD protection at a system or board level and test according to the IEC 61000-4-2 [1] or ISO 10605 [6] system-level ESD standard. Table 1-1 summarizes key differences between IC- or component-level standard HBM testing and system-level testing as required by IEC 61000-4-2 [1] and ISO 10605 [6] standards.

Table 1-1 Comparison of IC-Level HBM and System-Level ESD Tests [2]
Parameter IC-Level HBM Test
(ANSI/ESDA/JEDEC JS-001) [3]
System-Level ESD Test
(IEC 61000-4-2 [1], ISO 10605 [6])
Stressed Pin Group Multitude of pin combinations Few special pins
Device Power Non-powered Powered and non-powered
Test Methodology Standardized Application specific using various discharge models
Failure Signature Leakage or physical device damage Functional or application failure or physical device damage
Testing and Qualification Owned by Silicon vendor or component manufacturer System board designers or OEMs
Test Setup Commercial tester and sockets Application-specific board
Typical Qualification Goal 1 kV to 2 kV HBM 8 kV to 15 kV
Corresponding Peak Current 0.65 A to 1.3 A >20 A
ESD Environment Assembly and production processes End-user application, consumer product

The component-level ESD and the system-level ESD test requirements are different as they address different ESD environments. Also, the ESD current waveforms associated with the two tests differ significantly in terms of peak current, duration, and total power. Therefore, to design an ESD robust system, it is important for the system board designers and OEMs to understand that system-level ESD protection requirements are much different from IC-level ESD protection capabilities..