SLAS590P March 2009 – September 2020
PRODUCTION DATA
THERMAL METRIC(1) | VALUE | UNIT | |||
---|---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance, still air | Low-K board (JESD51-3) | LQFP (PN) | 70 | °C/W |
VQFN (RGC) | 55 | ||||
BGA (ZQE) | 84 | ||||
High-K board (JESD51-7) | LQFP (PN) | 45 | |||
VQFN (RGC) | 25 | ||||
BGA (ZQE) | 46 | ||||
RθJC | Junction-to-case thermal resistance | LQFP (PN) | 12 | °C/W | |
VQFN (RGC) | 12 | ||||
BGA (ZQE) | 30 | ||||
RθJB | Junction-to-board thermal resistance | LQFP (PN) | 22 | °C/W | |
VQFN (RGC) | 6 | ||||
BGA (ZQE) | 20 |