SLAU278AH May   2009  – March 2021

 

  1. 1Read This First
    1. 1.1 How to Use This Manual
    2. 1.1 Information About Cautions and Warnings
    3. 1.1 Related Documentation From Texas Instruments
    4. 1.1 If You Need Assistance
    5. 1.1 Trademarks
  2. 1Get Started Now!
    1. 1.1  Kit Contents, MSP-TS430xx
    2. 1.2  Kit Contents, MSP-FET430xx
    3. 1.3  Kit Contents, MSP-FET
    4. 1.4  Kit Contents, MSP-FET430UIF
    5. 1.5  Kit Contents, MSP-FET430PIF
    6. 1.6  Kit Contents, eZ430-F2013
    7. 1.7  Kit Contents, eZ430-T2012
    8. 1.8  Kit Contents, eZ430-RF2500
    9. 1.9  Kit Contents, eZ430-RF2500T
    10. 1.10 Kit Contents, eZ430-RF2500-SEH
    11. 1.11 Kit Contents, eZ430-Chronos-xxx
    12. 1.12 Kit Contents, FET430F6137RF900
    13. 1.13 Kit Contents, EM430Fx1x7RF900
    14. 1.14 Hardware Installation, MSP-FET and MSP-FET430UIF
    15. 1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900
    16. 1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529
    17. 1.17 Important MSP430 Documents on the Web
  3. 2Design Considerations for In-Circuit Programming
    1. 2.1 Signal Connections for In-System Programming and Debugging
    2. 2.2 External Power
    3. 2.3 Bootloader (BSL)
      1.      A Frequently Asked Questions and Known Issues
        1.       A.1 Hardware FAQs
        2.       A.2 Known Issues
          1.        MSP-FET430UIF
          2.        MSP-FET430PIF
            1.         B Hardware
              1.          B.1 MSP-TS430D8
              2.          B.2 MSP-TS430PW14
              3.          B.3 MSP-TS430L092
              4.          B.4 MSP-TS430L092 Active Cable
              5.          B.5 MSP-TS430PW20
              6.          B.6 MSP-TS430RHL20
              7.          B.7 MSP-TS430PW24
              8.          B.8 MSP-TS430RGE24A
              9.          B.9 MSP-TS430DW28
              10.          B.10 MSP-TS430PW28
              11.          B.11 MSP-TS430PW28A
              12.          B.12 MSP-TS430RHB32A
              13.          B.13 MSP-TS430DA38
              14.          B.14 MSP-TS430QFN23x0
              15.          B.15 MSP-TS430RSB40
              16.          B.16 MSP-TS430RHA40A
              17.          B.17 MSP-TS430DL48
              18.          B.18 MSP-TS430PT48
              19.          B.19 MSP-TS430PT48A
              20.          B.20 MSP-TS430RGZ48B
              21.          B.21 MSP-TS430RGZ48C
              22.          B.22 MSP-TS430PM64
              23.          B.23 MSP-TS430PM64A
              24.          B.24 MSP-TS430PM64D
              25.          B.25 MSP-TS430PM64F
              26.          B.26 MSP-TS430RGC64B
              27.          B.27 MSP-TS430RGC64C
              28.          B.28 MSP-TS430RGC64USB
              29.          B.29 MSP-TS430PN80
              30.          B.30 MSP-TS430PN80A
              31.          B.31 MSP-TS430PN80B
              32.          B.32 MSP-TS430PN80C
              33.          B.33 MSP-TS430PN80USB
              34.          B.34 MSP-TS430PZ100
              35.          B.35 MSP-TS430PZ100A
              36.          B.36 MSP-TS430PZ100B
              37.          B.37 MSP-TS430PZ100C
              38.          B.38 MSP-TS430PZ100D
              39.          B.39 MSP-TS430PZ100E
              40.          B.40 MSP-TS430PZ5x100
              41.          B.41 MSP-TS430PZ100USB
              42.          B.42 MSP-TS430PZ100AUSB
              43.          B.43 MSP-TS430PEU128
              44.          B.44 EM430F5137RF900
              45.          B.45 EM430F6137RF900
              46.          B.46 EM430F6147RF900
                1.           C Hardware Installation Guide
                  1.            D Revision History

Hardware FAQs

  1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information
    Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire (2-wire) JTAG configuration and only to the period while a debug session is active.
    Workarounds:
    • Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.
    • Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down menu (at top of Debug View). This prevents the debugger from accessing the MSP430 device while the application is running. Note that, in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature.
    • Use an external clock source to drive XIN directly.
  2. With current interface hardware and software, there is a weakness when adapting target boards that are powered externally. This leads to an accidental fuse check in the MSP430 device. This is valid for PIF and UIF but is seen most often on the UIF. A solution is being developed.
    Workarounds:
    • Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the RST line, which also resets the device internal fuse logic.
    • Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down menu. This prevents the debugger from accessing the MCU while the application is running. Note that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for more information on this feature.
    • Use an external clock source to drive XIN directly.
  3. The 14-conductor cable that connects the FET interface module and the target socket module must not exceed 8 inches (20 centimeters) in length.
  4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the USB FET.
  5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket module. See the schematic of the target socket module to populate the capacitor according to the data sheet of the device.
  6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed on the target socket module. See the schematic of the target socket module to populate the capacitor according to the data sheet of the device.
  7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module. For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal data sheets for the value of capacitance.
  8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or C-SPY (as any required clocking and timing is derived from the internal DCO and FLL).
  9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:
    For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.
    For C-SPY: "Release JTAG On Go" must be selected.
  10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the MSP430 is that the family members are code and architecturally compatible, so code developed on one device (for example, one without shared JTAG and port pins) ports effortlessly to another (assuming an equivalent set of peripherals).
  11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI. Customers should erase the information memory before its first use. Main memory of packaged devices is blank when the device is delivered from TI.
  12. The device current is higher then expected. The device current measurement may not be accurate with the debugger connected to the device. For accurate measurement, disconnect the debugger. Additionally some unused pins of the device should be terminated. See the Connection of Unused Pins table in the device's family user's guide.
  13. MSP-FETv2 – SBW may have issues with some target socket boards. Check the capacitance of the RST (SBWTDIO) line. If there is no capacitance, you may need to add at least 100 pF to the RST signal. The additional capacity on the RST line ensures that the timing between the SBWTDIO and SBWTCK signals is synchronized.
  14. The following ZIF sockets are used in the FET tools and target socket modules:
    • 8-pin device (D package): Yamaichi IC369-0082
    • 14-pin device (PW package): Enplas OTS-14-065-01
    • 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146
    • 24-pin package (PW package): Enplas OTS-24(28)-0.65-02
    • 28-pin device (DW package): Wells-CTI 652 D028
    • 28-pin device (PW package): Enplas OTS-28-0.65-01
    • 38-pin device (DA package): Yamaichi IC189-0382-037
    • 40-pin device (RHA package): Enplas QFN-40B-0.5-01
    • 40-pin device (RSB package): Enplas QFN-40B-0.4
    • 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001
    • 48-pin device (DL package): Yamaichi IC51-0482-1163
    • 64-pin device (PM package): Yamaichi IC51-0644-807
    • 64-pin device (RGC package): Yamaichi QFN11T064-006
    • 80-pin device (PN package): Yamaichi IC201-0804-014
    • 100-pin device (PZ package): Yamaichi IC201-1004-008
    • 128-pin device (PEU package): Yamaichi IC500-1284-009P

    Enplas: www.enplas.com

    Wells-CTI (Sensata Technologies): www.sensata.com

    Yamaichi: www.yeu.com