SLAU873C January   2023  – January 2024

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Getting Started
    1. 1.1 Introduction
    2. 1.2 Key Features
    3. 1.3 What's Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 Software Examples
    4. 1.4 First Step: Out-of-Box Experience
      1. 1.4.1 Connecting to the Computer
      2. 1.4.2 Running the Out-of-Box Experience
    5. 1.5 Next Steps: Looking Into the Provided Code
  5. 2Hardware
    1. 2.1 Jumper Map
    2. 2.2 Block Diagram
    3. 2.3 Hardware Features
      1. 2.3.1 MSPM0G3507 MCU
      2. 2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      3. 2.3.3 Debug Probe Connection Isolation Jumper Block
      4. 2.3.4 Application (or Backchannel) UART
      5. 2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET
      6. 2.3.6 Using the XDS110-ET Debug Probe With a Different Target
      7. 2.3.7 Special Features
        1. 2.3.7.1 Up to 4-Msps High-Speed Analog-to-Digital Converter
        2. 2.3.7.2 Thermistor
        3. 2.3.7.3 Light Sensor
    4. 2.4 Power
      1. 2.4.1 XDS110-ET USB Power
    5. 2.5 External Power Supply and BoosterPack Plug-in Module
    6. 2.6 Measure Current Draw of the MSPM0 MCU
    7. 2.7 Clocking
    8. 2.8 BoosterPack Plug-in Module Pinout
  6. 3Software Examples
  7. 4Resources
    1. 4.1 Integrated Development Environments
      1. 4.1.1 TI Cloud Development Tools
      2. 4.1.2 TI Resource Explorer Cloud
      3. 4.1.3 Code Composer Studio Cloud
      4. 4.1.4 Code Composer Studio IDE
    2. 4.2 MSPM0 SDK and TI Resource Explorer
    3. 4.3 MSPM0G3507 MCU
      1. 4.3.1 Device Documentation
      2. 4.3.2 MSPM0G3507 Code Examples
    4. 4.4 Community Resources
      1. 4.4.1 TI E2E™ Forums
  8. 5Schematics
  9. 6Revision History

MSPM0G3507 MCU

The MSPM0G3507 devices provide 128KB of embedded flash program memory with built-in error correction code (ECC) and 32KB of SRAM with hardware parity. The devices also incorporate a memory protection unit, 7-channel DMA, math accelerator, and a variety of high-performance analog peripherals such as two 12-bit 4-Msps ADCs, a configurable internal shared voltage reference, one 12-bit DAC, three high speed comparators with built-in reference DACs, two zero-drift op-amps with programmable gain, and one general-purpose amplifier. The devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, three 16-bit general purpose timers, one 32-bit high resolution timer, two windowed-watchdog timers, and one RTC with alarm and calendar mode. These devices provide data integrity and encryption peripherals (AES, CRC, TRNG) and enhanced communication interfaces (four UART, two I2C, two SPI, and one CAN 2.0/FD).

Device feature include:

  • 1.62V to 3.6V operation
  • Arm 32-bit Cortex-M0+ with memory protection unit, up to 80MHz
  • 128KB of flash with built-in ECC and 32KB of SRAM with hardware parity
  • Two 12-bit 4-Msps ADCs
  • 12-bit DAC
  • Two zero-drift zero-crossover chopper op-amps
  • Two 16-bit advanced control timers
  • Three 16-bit general-purpose timers
  • One 32-bit high-resolution time
  • 60 GPIO
GUID-20210614-CA0I-QQ8L-8DRS-FSCXGMK9DCCJ-low.svg Figure 2-3 LQFP64 Pinout (Top View)