2 Understanding the Process and Methodology to Achieve a Solution

Thermal analysis of an ABS system is an important component of the design and verification process. Like most complex problems it is helpful to break the task into smaller pieces to simplify and clarify the process.

First, critical IC and system specifications must be identified to provide quantitative data inputs. Second, calculations are made using the system inputs to find current, time, and power. Third, printed circuit board (PCB), heat sink, plastic module case, and other hardware components must be identified, and analyzed to calculate hardware data inputs. Fourth, a thermal simulation software tool can be used to convert the system’s profile into heat and temperature data. Finally, the loop is closed when the resulting heat and temperature data are compared against specified limits for each system component, including the TPIC7218-Q1.

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