The following guidelines are provided for EMI containment:

• Use compact loops for dv/dt and di/dt circuit paths (power loops and gate drives).
• Use minimal, yet thermally adequate, copper areas for heat sinking of components tied to switching nodes (minimize exposed radiating surface).
• Use copper ground planes (possible stitching) and top-layer copper floods (surround circuitry with ground floods).
• Use a 4-layer PCB, if economically feasible (for better grounding).
• Minimize the amount of copper area associated with input traces (to minimize radiated pickup).
• Hide copper associated with switching nodes under shielded magnetics, where possible.
• Heat sink the quiet side of components instead of the switching side, where possible (like the output side of inductor).
• Use Bob Smith terminations, Bob Smith EFT capacitor, and Bob Smith plane.
• Use Bob Smith plane as ground shield on the input side of the PCB (creating a phantom or literal earth ground).
• Use LC filter at DC/DC input.
• Dampen high-frequency ringing on all switching nodes, if present (allow for possible snubbers).
• Control rise times with gate-drive resistors and possibly snubbers.
• Switching frequency considerations
• Use of EMI bridge capacitor across isolation boundary (isolated topologies).
• Observe the polarity dot on inductors (embed noisy end).
• Use of ferrite beads on input (allow for possible use of beads or 0-Ω resistors).
• Maintain physical separation between input-related circuitry and power circuitry (use ferrite beads as boundary line).
• Balance efficiency versus acceptable noise margin.
• Possible use of common-mode inductors.
• Possible use of integrated RJ-45 jacks (shielded with internal transformer and Bob Smith terminations).
• End-product enclosure considerations (shielding).