SLVUCI1A August   2022  – December 2022 TPS281C30

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Compatibility Across Silicon Versions
  5. 3BoosterPack™ Plug-in Module Operation
  6. 4TPS281C30EVM Schematic
  7. 5Connection Descriptions
  8. 6TPS281C30EVM Assembly Drawings and Layout
  9. 7Bill of Materials
  10. 8Revision History

Introduction

The Texas Instruments TPS281C30EVM is an evaluation module that is used to demonstrate and showcase all of the features of the underlying TPS281C30 industrial high side switch. This evaluation board provides a seamless way to connect a set of power supplies to the inputs of the TPS281C30, connect loads to the output channels, and switch on and off the device using the control pins of the chip itself. An on-board 3.3-V LDO is included on the EVM to simplify controlling signals to the TPS281C30 and easily assert and deassert logic signals by the use of a set of external hardware jumpers. Additionally, this EVM includes BoosterPack plug-in module headers allowing the user to easily connect the TPS281C30 high side switch to an underlying microcontroller and write software to control and configure the device.

Features of the TPS281C30EVM include:

  • Adjustable current limit with on-board potentiometer
  • Configurable current sense with either fixed resistor or on-board potentiometer
  • BoosterPack plug-in module headers allowing power switch to be controlled by external microcontroller
  • On-board 3.3-V LDO allowing for control signals to be manipulated by a set of jumpers
  • Ideal board layout and copper area for thermal performance
  • Ability to support versions A, B, C, and D of the TPS281C30
  • Jumper at the output to support different clamp configurations for inductive discharge (version C, D of TPS281C30)
  • Optional footprint to populate TVS diode for VDS clamp for faster inductive discharge (version C, D of TPS281C30)