SLVUCK2A january   2023  – april 2023 TPS7H3302-SEP

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Description
    1. 2.1 Related Information
    2. 2.2 Typical Applications
    3. 2.3 Features
    4. 2.4 Performance Specification Summary
  5. 3Test Setup
    1. 3.1 Equipment
      1. 3.1.1 Power Supplies
      2. 3.1.2 Load #1
    2. 3.2 EVM Connectors and Test Points
    3. 3.3 Testing Procedure
      1. 3.3.1 EVM Bode Plot Measurement Setup
      2. 3.3.2 EVM Transient Test
  6. 4Board Layout
  7. 5Schematic
  8. 6Bill of Materials
  9. 7Related Documentation
  10. 8Revision History

Board Layout

GUID-20230412-SS0I-J6JX-G5MQ-MCLSX313L35X-low.svg Figure 4-1 Top Overlay
GUID-20230412-SS0I-S2RP-MJ5H-XP061XSJBCQG-low.svg Figure 4-2 Top Solder
GUID-20230412-SS0I-XGQZ-3TC0-7TVZCLXJDVG9-low.svg Figure 4-3 Top Layer
GUID-20230412-SS0I-P9HT-WBJH-MNSWL74XMCVJ-low.svg Figure 4-4 Signal and Power Layer 1
GUID-20230412-SS0I-DGKP-8JCB-DFWPFXNNTNQC-low.svg Figure 4-5 Signal and Power Layer 2
GUID-20230412-SS0I-FNQH-7QP0-C7PQJZ3CS3FW-low.svg Figure 4-6 Bottom Layer
GUID-20230412-SS0I-RKJX-68NR-XVQ8W12WPVR4-low.svg Figure 4-7 Bottom Solder