SLVUCQ7 july   2023 TPS7H2201-SEP

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 EVM Connectors and Test Points
      1. 2.1.1 Alternate EVM Configurations
  7. 3Implementation Results
    1. 3.1 Default Configuration Results
  8. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials
  9. 5Additional Information
    1.     Trademarks
  10. 6Related Documentation

Alternate EVM Configurations

The default EVM configuration has a single device and the external components populated, however, an additional device can be populated. This allows testing for two different dual-device applications:

  1. Redundant - Each device has a different VIN source but a common VOUT. The common VOUT is already implemented on the EVM through a shared plane. In this configuration, each device has a separate external components.
  2. Parallel - Each device has the same VIN source as well as a common VOUT. To connect the VIN for both devices, populate the 4 parallel size 2512, 1-W, 0-Ω resistors (R8, R9, R10 and R11). The EN, OVP, CS, SS, RTIMER and ILTIMER pin nodes of the devices must sepalso be connected by populating 0-Ω resistors (R19, R21, R23, R20, R22 and R24 respectively). The external components for U2, except for the IL pin, are also typically removed for parallel operation.
GUID-20230210-SS0I-PWTN-TDGL-G6L0VLHZJGGP-low.svgFigure 2-1 Redundant Configuration Example
GUID-20230127-SS0I-V8CQ-JJCT-GH5XNPTWKZZF-low.svgFigure 2-2 Parallel Configuration Example