Understanding the reference origin of the device to properly position the device relative to the magnet is important for placing a sensor within a simulation. Placing the sensor at (0,0,0) results in the face of the package body located at the global origin, which touches the PCB. TIMSS assumes this location matches the appropriate package drawing from the device data sheet and calculates the actual sensing element position within the package.

For better understanding, see the following reference diagrams for Figure 10-1, Figure 10-3, and Figure 10-5 packages. The red X in the diagram represents the package origin used in TIMSS.

Figure 10-1 SOT-23 Package Reference Location

Figure 10-2 DRV5032 SOT-23 Sensor Location in Package

Figure 10-3 T0-92 Package Reference Location

Figure 10-4 DRV5032 T0-92 Sensor Location in Package

Notably, the through hole leads are not centered in the package. The package center shown in the top down view is roughly aligned to the start of the bevel edge.

Figure 10-5 X2SON Package Reference Location

Figure 10-6 DRV5032 X2SON Sensor Location in Package

The same method for locating the package center is followed on all other devices not shown.