SNIS175A March   2013  – January 2015 LMT88

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT88 Transfer Function
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Centigrade Thermostat
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 System Examples
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

DCK Package
5-Pin SOT
Top View
top_view_pack_number_nis175.gif

Pin Functions

PIN TYPE DESCRIPTION
NAME NO.
NC 1 NC (pin 1) must be left floating or grounded. Other signal traces must not be connected to this pin.
GND 2 GND Device substrate and die attach paddle, connect to power supply negative terminal. For optimum thermal conductivity to the PCB ground plane, pin 2 must be grounded. This pin may also be left floating.
VO 3 Analog Output Temperature sensor analog output
V+ 4 Power Positive power supply pin
GND 5 GND Device ground pin, connect to power supply negative terminal.