SNOU195 july   2023 LDC5072-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. Introduction
  5. Gaining Access to the LDC5072 Sensor Design Tool
  6. Installer Setup
  7. Installing the Tool
  8. Tool Overview
  9. Using the Tool to Create a Design and Generate a Supporting SPICE Model and Gerber Files
  10. Running Simulations in Pspice
  11. Layout, Bill-of-Materials, and Schematic of the Test PC board
  12. Troubleshooting
  13. 10Revision History

Layout, Bill-of-Materials, and Schematic of the Test PC board

As mentioned previously, the tool creates Gerber files of the sensor, target, and an evaluation PC board layout with a *.pdf file representation of the design. The images below show examples of PC boards created from the tool's default settings.

GUID-20230515-SS0I-ZLLP-PF79-QP0ZLT95WRBX-low.jpg Figure 8-1 Top Side of Sensor, LDC5072 and Target PC boards created by the LDC5072 Sensor Design Tool
GUID-20230515-SS0I-1PMZ-QHFN-X60J3G4F18CC-low.jpg Figure 8-2 Underside of Sensor, LDC5072 and Target PC boards created by the LDC5072 Sensor Design Tool

The schematic of the evaluation PC board created by the design is shown in the figure just below, and the parts list is shown in Table 8-1. Part placement on the PC board is shown in Figure 8-4.

GUID-20230515-SS0I-RVXX-0QBC-WM8GQHTLJ5VK-low.png Figure 8-3 Evaluation PC Board Schematic Without Sensor
Table 8-1 LDC5072Q1EVM BOM
Designator Quantity Value Description Package PartNumber Manufacturer
C1 1 0.01uF CAP, CERM, 0.01 uF, 25 V, +/- 10%, X7R, 0603 0603 GRM188R71E103KA01D MuRata
C2 1 0.1uF CAP, CERM, 0.1 uF, 25 V, +/- 10%, X7R, 0603 0603 C1608X7R1E104K080AA TDK
C3 1 1uF CAP, CERM, 1 uF, 35 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0603 0603 CGA3E1X7R1V105K080AC TDK
C4, C5, C6, C9 4 6800 pF CAP, CERM, 6800 pF, 25 V, +/- 10%, X7R, 0603 0603 GRM188R71E682KA01D MuRata
H9, H10, H11, H12 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3 M
J1 1 Standard Banana Jack, insulated, 10 A, red 571-0500 571-0500 DEM Manufacturing
J2 1 Standard Banana Jack, insulated, 10 A, black 571-0100 571-0100 DEM Manufacturing
J4 1 FFC/FPC Connector, 6 POS, 0.5mm, R/A, Tin, SMT FFC/FPC Connector, 6 POS, 0.5mm, R/A, SMT 52745-0633 Molex
J8, J9 2 Header, 2.54mm, 2x1, Tin, TH Header, 2.54mm, 2x1, TH 22284023 Molex
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll PCB Label 0.650 x 0.200 inch THT-14-423-10 Brady
R1, R2, R3, R4, R10 5 0 RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06030000Z0EA Vishay-Dale
R5 1 49.9k RES, 49.9 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 ERJ-3EKF4992V Panasonic
R7, R11, R12, R13, R14, R15 6 0 RES, 0, 5%, 0.125 W, AEC-Q200 Grade 0, 0805 0805 CRCW08050000Z0EA Vishay-Dale
R9 1 50k Trimming Potentiometer, 50K, 0.5W, TH 9.53x8.89mm 3352T-1-503LF Bourns
R16, R17, R18, R19 4 10.0k RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060310K0FKEA Vishay-Dale
SH-J1 1 Shunt, 2.54mm, Gold, Black Shunt, 2.54mm, Black 60900213421 Wurth Elektronik
TP1, TP2, TP3 3 Test Point, Compact, Blue, TH Blue Compact Testpoint 5122 Keystone
TP4, TP5, TP6 3 Test Point, Compact, Black, TH Black Compact Testpoint 5006 Keystone
U1 1 Inductive Position Sensor with Sin/Cos Interface, PW0016A (TSSOP-16) PW0016A LDC5072PWQ1 Texas Instruments
C7, C8, C13, C14, C15, C16, C19, C20, C21, C22, C25, C26 0 18 pF CAP, CERM, 18 pF, 100 V, +/- 5%, C0G/NP0, 0603 0603 GRM1885C2A180JA01D MuRata
C10, C17, C23 0 330 pF CAP, CERM, 330 pF, 50 V, +/- 5%, C0G/NP0, 0805 0805 08055A331JAT2A AVX
C11, C18, C24 0 330 pF CAP, CERM, 330 pF, 50 V, +/- 1%, C0G/NP0, 0603 0603 C1608C0G1H331F080AA TDK
C12 0 0.1uF CAP, CERM, 0.1 uF, 25 V, +/- 10%, X7R, 0603 0603 C1608X7R1E104K080AA TDK
FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
J3 0 Terminal Block, 4x1, 2.54 mm, Green, TH Terminal Block, 4x1, 2.54 mm, TH 1725672 Phoenix Contact
J5, J6, J7 0 Header, 100mil, 2x1, Gold, TH 2x1 Header TSW-102-07-G-S Samtec
R6 0 10k RES, 10 k, 5%, 0.1 W, 0603 0603 RC0603JR-0710KL Yageo
R8 0 1.0k RES, 1.0 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06031K00JNEA Vishay-Dale
GUID-20230515-SS0I-XBCQ-HCVH-JHCBXDDZLKPV-low.png Figure 8-4 Detailed EVM Relative Part Placement for Soldered Components - Identical to Tool-Generated EVM