SPRZ492A September   2020  – October 2020 TMS320F2812 , TMS320F2812-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1Package Redesign Details

1 Package Redesign Details

Explanation

The devices in the MicroStar BGA™ packaging were redesigned using a laminate nfBGA package. This nfBGA package offers datasheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar BGA. For more details, please refer to this nfBGA Packaging Application Report.

When referencing the device data sheet, use the new package designator in place of the discontiued package designator throughout the document.

The orderable addendum at the end of the device data sheet will reflect the new package designator.

See the following page or the end of the device data sheet for the updated nfBGA package drawing.

Table 1-1 Package Designator
Old Package Designator New Package Designator
GHH GBB
ZHH ZAY

Reason for Discontinuance

Due to an equipment End-Of-Life notice from our substrate supplier, we are phasing out certain MicroStar BGA and MicroStar Junior™ BGA packaging devices and offering a Last Time Buy.

These devices have now been converted to an nfBGA package.

Devices Affected

The following table describes the devices affected, the old and new package designators, and references to the device data sheet.

Table 1-2 Devices and Nomenclature
Device Discontinued MicroStar BGA Device Redesigned Laminate nfBGA Device Device Data Sheet
TMS320F281x TMS320F2812GHHATMS320F2812GHHARTMS320F2812GHHQTMS320F2812GHHS TMS320F2812GBBATMS320F2812GBBARTMS320F2812GBBSTMS320F2812GBBS SPRS174
TMS320F281x TMS320F2812ZHHATMS320F2812ZHHARTMS320F2812ZHHS TMS320F2812ZAYATMS320F2812ZAYARTMS320F2812ZAYS SPRS174