SWRZ153 November   2023 CC1312PSIP

 

  1.   1
  2.   Abstract
  3. 1Advisories Matrix
  4. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support-Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  5. 3Advisories
    1.     Advisory Power_03
    2.     Advisory PKA_01
    3.     Advisory PKA_02
    4.     Advisory I2C_01
    5.     Advisory I2S_01
    6.     Advisory CPU_01
    7.     Advisory CPU_02
    8.     Advisory CPU_03
    9.     Advisory CPU_Sys_01
    10.     Advisory Sys_01
    11. 3.1 Sys_05
    12.     Advisory SYSCTRL_01
    13.     IOC_01
    14.     SRAM_01
    15.     GPTM_01
    16.     ADC_01
    17.     ADC_02
    18.     ADC_03
    19.     ADC_04
    20.     ADC_05
  6.   Trademarks
  7. 4Revision History

2.3 Package Symbolization and Revision Identification

Figure 2-1 and Table 2-1 describe package symbolization and the device revision code.


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Figure 2-1 Package Symbolization
Table 2-1 Revision Identification
DEVICE REVISION CODESILICON REVISION
FPG3.0

The die markings do not indicate the silicon revision. However, customers can determine the silicon revision by one of the following methods:

  1. TI provided software functions in chipinfo.c:
    • HwRevision_t ChipInfo_GetHwRevision( void )
    • Returns: chip HW revision
    • HWREV_2_2 is returned for CC1312PSIP revision F.
  1. SmartRF™ Studio:
    • When connecting to a CC1312PSIP device, the version number is shown in the lower-left corner.
    • Device Identification with SmartRF™ Studio: CC1312PSIP, Rev. F (3.0), XDS-LS42012N.
  2. Package label:
    • The die revision name is shown on the tape and reel label.
    • Entry (2P) lists the revision F.