SBOS780C March   2016  – June 2021 THS3215

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: D2S
    6. 6.6  Electrical Characteristics: OPS
    7. 6.7  Electrical Characteristics: D2S + OPS
    8. 6.8  Electrical Characteristics: Midscale (DC) Reference Buffer
    9. 6.9  Typical Characteristics: D2S + OPS
    10. 6.10 Typical Characteristics: D2S Only
    11. 6.11 Typical Characteristics: OPS Only
    12. 6.12 Typical Characteristics: Midscale (DC) Reference Buffer
    13. 6.13 Typical Characteristics: Switching Performance
    14. 6.14 Typical Characteristics: Gain Drift
  7. Parameter Measurement Information
    1. 7.1 Overview
    2. 7.2 Frequency Response Measurement
    3. 7.3 Harmonic Distortion Measurement
    4. 7.4 Noise Measurement
    5. 7.5 Output Impedance Measurement
    6. 7.6 Step-Response Measurement
    7. 7.7 Feedthrough Measurement
    8. 7.8 Midscale Buffer ROUT Versus CLOAD Measurement
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Differential to Single-Ended Stage (D2S) With Fixed Gain of 2 V/V (Pins 2, 3, 6, and 14)
      2. 8.3.2 Midscale (DC) Reference Buffer (Pin 1 and Pin 15)
      3. 8.3.3 Output Power Stage (OPS) (Pins 4, 7, 9, 10, 11, and 12)
        1. 8.3.3.1 Output DC Offset and Drift for the OPS
        2. 8.3.3.2 OPS Harmonic Distortion (HD) Performance
        3. 8.3.3.3 Switch Feedthrough to the OPS
        4. 8.3.3.4 Driving Capacitive Loads
      4. 8.3.4 Digital Control Lines
    4. 8.4 Device Functional Modes
      1. 8.4.1 Full-Signal Path Mode
        1. 8.4.1.1 Internal Connection With Fixed Common-Mode Output Voltage
        2. 8.4.1.2 Internal Connection With Adjustable Common-Mode Output Voltage
        3. 8.4.1.3 External Connection
      2. 8.4.2 Dual-Output Mode
      3. 8.4.3 Differential I/O Voltage Mode
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Applications
        1. 9.1.1.1 High-Frequency, High-Voltage, Dual-Output Line Driver for AWGs
          1. 9.1.1.1.1 Design Requirements
          2. 9.1.1.1.2 Detailed Design Procedure
          3. 9.1.1.1.3 Application Curves
        2. 9.1.1.2 High-Voltage Pulse-Generator
          1. 9.1.1.2.1 Design Requirements
          2. 9.1.1.2.2 Detailed Design Procedure
          3. 9.1.1.2.3 Application Curves
        3. 9.1.1.3 Single-Supply, AC-Coupled, Piezo Element Driver
          1. 9.1.1.3.1 Detailed Design Procedure
        4. 9.1.1.4 Output Common-Mode Control Using the Midscale Buffer as a Level Shifter
          1. 9.1.1.4.1 Detailed Design Procedure
        5. 9.1.1.5 Differential I/O Driver With independent Common-Mode Control
          1. 9.1.1.5.1 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Thermal Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI (Free Software Download)
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Internal Connection With Fixed Common-Mode Output Voltage

The most basic operation is to ground VREF (pin 14), and use the internal connection from the D2S to the OPS to provide a differential to single-ended, high-power driver. Figure 8-15 shows the characterization circuit used for the combined performance specifications.

GUID-42BFEE7D-C13B-4FA0-9E1B-4208C1FBF3AF-low.gifFigure 8-15 Differential to Single-Ended, Gain of 5 V/V Configuration

This configuration shows the test circuit used to generate Figure 6-1. Some of the key features in this basic configuration include:

  1. The power supplies are brought into the OPS first, then back to the input stage through a π-filter comprised of a ferrite bead and local decoupling capacitors on –VCC2 and +VCC2 (pins 5 and 16, respectively). See the Section 10 section for more information.
  2. The two logic lines are grounded. This logic configuration (with pin 7 grounded) selects the internal path from the D2S to OPS, and enables the OPS.
  3. The external I/O pins of the midscale buffer are left floating.
  4. The VREF pin is grounded, thus setting the D2S output common-mode voltage at VO1 (pin 6) to ground.
  5. The D2S external output is loaded with a 200 Ω resistor to ground. Lighter loading on the VO1 pin (versus the 100 Ω used to characterize the D2S only) results in increased frequency response peaking. Heavier loading degrades the D2S distortion performance.
  6. The external OPS input at VIN+ (pin 9) is left floating. However, VIN+ is internally tied to ground by the internal 18.5 kΩ resistor.
  7. The feedback resistor in the OPS is set to the parallel combination of the external 249 Ω resistor and the internal 18.5 kΩ resistor. This 245.7 Ω total RF with the 162 Ω RG resistor results in a gain of approximately 2.5 V/V (7.98 dB) in the OPS.
  8. The input D2S provides a gain of 2 V/V (6 dB), and along with the 2.5 V/V (7.98 dB) from the OPS, results in an overall gain of 5 V/V (13.98 dB) with > 600 MHz of SSBW (see Figure 6-1).