SCDS263D September   2009  – September 2019 TS3USB221E

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
      2.      Simplified Schematic, Each FET Switch (SW)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Dynamic Electrical Characteristics, VCC = 3.3 V ±10%
    7. 6.7  Dynamic Electrical Characteristics, VCC = 2.5 V ±10%
    8. 6.8  Switching Characteristics, VCC = 3.3 V ±10%
    9. 6.9  Switching Characteristics, VCC = 2.5 V ±10%
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Mode
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TS3USB221E UNIT
DRC (VSON) RSE (UQFN)
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 57.7 169.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 87.7 84.7
RθJB Junction-to-board thermal resistance 32.6 94.9
ψJT Junction-to-top characterization parameter 8.2 5.7
ψJB Junction-to-board characterization parameter 32.8 94.9
RθJC(bot) Junction-to-case (bottom) thermal resistance 18.5 N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.