SLAU869E October   2022  – January 2024

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Getting Started
    1. 1.1 Introduction
    2. 1.2 Key Features
    3. 1.3 What's Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 Software Examples
    4. 1.4 First Step Out-of-Box Experience
      1. 1.4.1 Connecting to the Computer
      2. 1.4.2 Running the Out-of-Box Experience
    5. 1.5 Next Steps: Looking Into the Provided Code
  5. 2Hardware
    1. 2.1 Jumper Map
    2. 2.2 Block Diagram
    3. 2.3 Hardware Features
      1. 2.3.1 MSPM0L1306 MCU
      2. 2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      3. 2.3.3 Debug Probe Connection: Isolation Jumper Block
      4. 2.3.4 Application (or Backchannel) UART
      5. 2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET
      6. 2.3.6 Using the XDS110-ET Debug Probe With a Different Target
      7. 2.3.7 Special Features
        1. 2.3.7.1 Thermistor
        2. 2.3.7.2 Light Sensor
    4. 2.4 Power
      1. 2.4.1 XDS110-ET USB Power
    5. 2.5 External Power Supply and BoosterPack Plug-in Module
    6. 2.6 Measure Current Draw of the MSPM0 MCU
    7. 2.7 Clocking
    8. 2.8 BoosterPack Plug-in Module Pinout
  6. 3Software Examples
  7. 4Resources
    1. 4.1 Integrated Development Environments
      1. 4.1.1 TI Cloud Development Tools
      2. 4.1.2 TI Resource Explorer Cloud
      3. 4.1.3 Code Composer Studio Cloud
      4. 4.1.4 Code Composer Studio IDE
    2. 4.2 MSPM0 SDK and TI Resource Explorer
    3. 4.3 MSPM0L1306 MCU
      1. 4.3.1 Device Documentation
      2. 4.3.2 MSPM0L1306 Code Examples
    4. 4.4 Community Resources
      1. 4.4.1 TI E2E Forums
  8. 5Schematics
  9. 6Revision History

MSPM0L1306 MCU

The MSPM0L1306 device provides up to 64KB embedded flash program memory with up to 4KB SRAM. The devices incorporate a high speed on-chip oscillator with an accuracy of ±1%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16 and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1-Msps ADC with configurable internal voltage reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover op-amps with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and two I2Cs. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus. Device feature include:

  • 1.62V to 3.6V operation
  • Arm 32-bit Cortex-M0+, up to 32MHz
  • 64KB of flash and 4KB SRAM
  • 12-bit 1-Msps ADC
  • Two zero-drift, zero-crossover chopper op-amps
  • Four 16-bit general purpose timers
  • Internal 4 to 32MHz oscillator with ±1% accuracy (SYSOSC)
  • 28 GPIOs
GUID-20210606-CA0I-RGTD-FPTW-SWG154HJLHKR-low.svg Figure 2-3 32-Pin RHB (VQFN) (Top View)